AMD E1-1500 vs Intel Core 2 Duo SU7300

Comparative analysis of AMD E1-1500 and Intel Core 2 Duo SU7300 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies, Virtualization, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

AMD E1-1500

Intel Core 2 Duo SU7300

Differences

Reasons to consider the AMD E1-1500

CPU is newer: launch date 3 year(s) 4 month(s) later
Around 14% higher clock speed: 1.48 GHz vs 1.3 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 40 nm vs 45 nm

Launch date	1 January 2013 vs 1 September 2009
Maximum frequency	1.48 GHz vs 1.3 GHz
Manufacturing process technology	40 nm vs 45 nm

Reasons to consider the Intel Core 2 Duo SU7300

3x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 80% lower typical power consumption: 10 Watt vs 18 Watt
Around 42% better performance in Geekbench 4 - Single Core: 177 vs 125
Around 40% better performance in Geekbench 4 - Multi-Core: 309 vs 221

Specifications (specs)
L2 cache	3 MB vs 1024 KB
Thermal Design Power (TDP)	10 Watt vs 18 Watt
Benchmarks
Geekbench 4 - Single Core	177 vs 125
Geekbench 4 - Multi-Core	309 vs 221

Compare benchmarks

CPU 1: AMD E1-1500
CPU 2: Intel Core 2 Duo SU7300

Geekbench 4 - Single Core

CPU 1

CPU 2

125

177

Geekbench 4 - Multi-Core

CPU 1

CPU 2

221

309

Name	AMD E1-1500	Intel Core 2 Duo SU7300
PassMark - Single thread mark	454
PassMark - CPU mark	391
Geekbench 4 - Single Core	125	177
Geekbench 4 - Multi-Core	221	309

Compare specifications (specs)

	AMD E1-1500	Intel Core 2 Duo SU7300
Essentials
Architecture codename	Zacate	Penryn
Launch date	1 January 2013	1 September 2009
Place in performance rating	3244	3290
Series	AMD E-Series	Intel Core 2 Duo
Vertical segment	Laptop	Laptop
Performance
64 bit support
Die size	75 mm	107 mm
L1 cache	128 KB
L2 cache	1024 KB	3 MB
Manufacturing process technology	40 nm	45 nm
Maximum case temperature (TCase)	100 °C
Maximum frequency	1.48 GHz	1.3 GHz
Number of cores	2	2
Number of threads	2	2
Front-side bus (FSB)		800 MHz
Transistor count		410 Million
Memory
Supported memory types	DDR3
Compatibility
Max number of CPUs in a configuration	1
Sockets supported	FT1 BGA 413-Ball	BGA956
Thermal Design Power (TDP)	18 Watt	10 Watt
Advanced Technologies
PowerNow
Enhanced Intel SpeedStep® technology
Virtualization
AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Security & Reliability
Intel® Trusted Execution technology (TXT)