AMD E2-9000e vs Intel Core i3-3110M

Comparative analysis of AMD E2-9000e and Intel Core i3-3110M processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Peripherals, Advanced Technologies, Virtualization, Graphics interfaces, Security & Reliability. Benchmark processor performance analysis: GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps), PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

 

Differences

Reasons to consider the AMD E2-9000e

  • Around 83233% higher clock speed: 2000 MHz vs 2.4 GHz
  • Around 25% more L1 cache; more data can be stored in the L1 cache for quick access later
  • 2x more L2 cache, more data can be stored in the L2 cache for quick access later
  • 5.8x lower typical power consumption: 6 Watt vs 35 Watt
Maximum frequency 2000 MHz vs 2.4 GHz
L1 cache 160 KB vs 128 KB
L2 cache 1024 KB vs 512 KB
Thermal Design Power (TDP) 6 Watt vs 35 Watt

Reasons to consider the Intel Core i3-3110M

  • 2 more threads: 4 vs 2
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 28 nm
  • Around 92% better performance in GFXBench 4.0 - T-Rex (Frames): 2703 vs 1406
  • Around 92% better performance in GFXBench 4.0 - T-Rex (Fps): 2703 vs 1406
Specifications (specs)
Number of threads 4 vs 2
Manufacturing process technology 22 nm vs 28 nm
Benchmarks
GFXBench 4.0 - T-Rex (Frames) 2703 vs 1406
GFXBench 4.0 - T-Rex (Fps) 2703 vs 1406

Compare benchmarks

CPU 1: AMD E2-9000e
CPU 2: Intel Core i3-3110M

GFXBench 4.0 - T-Rex (Frames)
CPU 1
CPU 2
1406
2703
GFXBench 4.0 - T-Rex (Fps)
CPU 1
CPU 2
1406
2703
Name AMD E2-9000e Intel Core i3-3110M
GFXBench 4.0 - Car Chase Offscreen (Frames) 319
GFXBench 4.0 - Car Chase Offscreen (Fps) 319
GFXBench 4.0 - Manhattan (Frames) 647
GFXBench 4.0 - Manhattan (Fps) 647
GFXBench 4.0 - T-Rex (Frames) 1406 2703
GFXBench 4.0 - T-Rex (Fps) 1406 2703
PassMark - Single thread mark 1240
PassMark - CPU mark 1637
Geekbench 4 - Single Core 440
Geekbench 4 - Multi-Core 991
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 1.374
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 5.372
CompuBench 1.5 Desktop - T-Rex (Frames/s) 0.213
CompuBench 1.5 Desktop - Video Composition (Frames/s) 0.686
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) 1.739

Compare specifications (specs)

AMD E2-9000e Intel Core i3-3110M

Essentials

Architecture codename Stoney Ridge Ivy Bridge
Family AMD E2-Series for Notebooks
Place in performance rating 2644 2618
Vertical segment Mobile Mobile
Launch date 1 September 2012
Launch price (MSRP) $225
Price now $139.95
Processor Number i3-3110M
Series Legacy Intel® Core™ Processors
Status Launched
Value for money (0-100) 6.48

Performance

64 bit support
Base frequency 1500 MHz 2.40 GHz
L1 cache 160 KB 128 KB
L2 cache 1024 KB 512 KB
Manufacturing process technology 28 nm 22 nm
Maximum frequency 2000 MHz 2.4 GHz
Number of cores 2 2
Number of threads 2 4
Transistor count 1.2 billion
Bus Speed 5 GT/s DMI
Die size 118 mm
L3 cache 3072 KB
Maximum core temperature 90 °C (PGA); 105 °C (BGA)

Memory

Max memory channels 1 2
Maximum memory bandwidth 14.9 GB/s 25.6 GB/s
Supported memory types DDR4-1866 DDR3/L/-RS 1333/1600
Maximum memory size 32 GB

Graphics

Graphics base frequency 600 MHz 650 MHz
Number of pipelines 128
Processor graphics Radeon R2 series Intel® HD Graphics 4000
Unified Video Decoder (UVD)
Video Codec Engine (VCE)
Device ID 0x166
Graphics max dynamic frequency 1.00 GHz
Graphics max frequency 1 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video

Compatibility

Package Size micro-BGA 37.5mm x 37.5mm (rPGA988B); 31mm x 24mm (BGA1023)
Sockets supported BGA (FT4) FCPGA988, FCBGA1023
Thermal Design Power (TDP) 6 Watt 35 Watt
Low Halogen Options Available
Max number of CPUs in a configuration 1

Peripherals

PCI Express revision 3.0 2.0
Max number of PCIe lanes 16
PCIe configurations 1x16, 2x8, 1x8 2x4

Advanced Technologies

Enhanced Virus Protection (EVP)
Fused Multiply-Add 3 (FMA3)
Fused Multiply-Add 4 (FMA4)
Intel® Advanced Vector Extensions (AVX)
Intel® Advanced Vector Extensions 2 (AVX2)
Intel® AES New Instructions
4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions Intel® AVX
Intel 64
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)

Graphics interfaces

CRT
DisplayPort
eDP
HDMI
Number of displays supported 3
SDVO
Wireless Display (WiDi) support

Security & Reliability

Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Trusted Execution technology (TXT)