AMD EPYC 7302 vs Intel Xeon Gold 6150

Comparative analysis of AMD EPYC 7302 and Intel Xeon Gold 6150 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD EPYC 7302

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm, 14 nm vs 14 nm
  • 5.3x more maximum memory size: 4 TB vs 768 GB
  • Around 6% lower typical power consumption: 155 Watt vs 165 Watt
  • Around 9% better performance in PassMark - CPU mark: 51573 vs 47300
Specifications (specs)
Manufacturing process technology 7 nm, 14 nm vs 14 nm
Maximum memory size 4 TB vs 768 GB
Thermal Design Power (TDP) 155 Watt vs 165 Watt
Benchmarks
PassMark - CPU mark 51573 vs 47300

Reasons to consider the Intel Xeon Gold 6150

  • 2 more cores, run more applications at once: 18 vs 16
  • 4 more threads: 36 vs 32
  • Around 12% higher clock speed: 3.70 GHz vs 3.3 GHz
  • Around 9% better performance in PassMark - Single thread mark: 2115 vs 1943
Specifications (specs)
Number of cores 18 vs 16
Number of threads 36 vs 32
Maximum frequency 3.70 GHz vs 3.3 GHz
Benchmarks
PassMark - Single thread mark 2115 vs 1943

Compare benchmarks

CPU 1: AMD EPYC 7302
CPU 2: Intel Xeon Gold 6150

PassMark - Single thread mark
CPU 1
CPU 2
1943
2115
PassMark - CPU mark
CPU 1
CPU 2
51573
47300
Name AMD EPYC 7302 Intel Xeon Gold 6150
PassMark - Single thread mark 1943 2115
PassMark - CPU mark 51573 47300

Compare specifications (specs)

AMD EPYC 7302 Intel Xeon Gold 6150

Essentials

Architecture codename Zen 2 Skylake
Launch date 7 Aug 2019 Q3'17
Launch price (MSRP) $978
OPN PIB 100-100000043WOF
OPN Tray 100-000000043
Place in performance rating 618 597
Vertical segment Server Server
Processor Number 6150
Series Intel® Xeon® Scalable Processors
Status Launched

Performance

Base frequency 3.0 GHz 2.70 GHz
L1 cache 1 MB
L2 cache 8 MB
L3 cache 128 MB
Manufacturing process technology 7 nm, 14 nm 14 nm
Maximum frequency 3.3 GHz 3.70 GHz
Number of cores 16 18
Number of threads 32 36
Unlocked
Maximum core temperature 89°C
Number of Ultra Path Interconnect (UPI) Links 3

Memory

ECC memory support
Max memory channels 8 6
Maximum memory bandwidth 204.8 GB/s
Maximum memory size 4 TB 768 GB
Supported memory types DDR4-3200 DDR4-2666
Supported memory frequency 2666 MHz

Compatibility

Socket Count 1P/2P
Sockets supported SP3 FCLGA3647
Thermal Design Power (TDP) 155 Watt 165 Watt
Low Halogen Options Available
Package Size 76.0mm x 56.5mm

Peripherals

Max number of PCIe lanes 128 48
PCI Express revision 4.0 3.0
PCIe configurations x16, x8
Scalability S4S

Advanced Technologies

AMD SenseMI
Fused Multiply-Add 3 (FMA3)
Intel® Advanced Vector Extensions (AVX)
Intel® Advanced Vector Extensions 2 (AVX2)
Intel® AES New Instructions
Enhanced Intel SpeedStep® technology
Instruction set extensions Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512
Intel 64
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Intel® vPro™ Platform Eligibility
Number of AVX-512 FMA Units 2
Speed Shift technology

Virtualization

AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)

Security & Reliability

Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Trusted Execution technology (TXT)
Mode-based Execute Control (MBE)