AMD EPYC 7302 vs Intel Xeon Gold 6230
Comparative analysis of AMD EPYC 7302 and Intel Xeon Gold 6230 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD EPYC 7302
- CPU is newer: launch date 4 month(s) later
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm, 14 nm vs 14 nm
- 4.7x more L3 cache, more data can be stored in the L3 cache for quick access later
- 4x more maximum memory size: 4 TB vs 1 TB
- Around 16% better performance in PassMark - CPU mark: 51242 vs 44140
| Specifications (specs) | |
| Launch date | 7 Aug 2019 vs 2 April 2019 |
| Manufacturing process technology | 7 nm, 14 nm vs 14 nm |
| L3 cache | 128 MB vs 27.5 MB |
| Maximum memory size | 4 TB vs 1 TB |
| Benchmarks | |
| PassMark - CPU mark | 51242 vs 44140 |
Reasons to consider the Intel Xeon Gold 6230
- 4 more cores, run more applications at once: 20 vs 16
- 8 more threads: 40 vs 32
- Around 18% higher clock speed: 3.90 GHz vs 3.3 GHz
- Around 25% more L1 cache; more data can be stored in the L1 cache for quick access later
- 2.5x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 24% lower typical power consumption: 125 Watt vs 155 Watt
- Around 11% better performance in PassMark - Single thread mark: 2159 vs 1952
| Specifications (specs) | |
| Number of cores | 20 vs 16 |
| Number of threads | 40 vs 32 |
| Maximum frequency | 3.90 GHz vs 3.3 GHz |
| L1 cache | 1.25 MB vs 1 MB |
| L2 cache | 20 MB vs 8 MB |
| Thermal Design Power (TDP) | 125 Watt vs 155 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 2159 vs 1952 |
Compare benchmarks
CPU 1: AMD EPYC 7302
CPU 2: Intel Xeon Gold 6230
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | AMD EPYC 7302 | Intel Xeon Gold 6230 |
|---|---|---|
| PassMark - Single thread mark | 1952 | 2159 |
| PassMark - CPU mark | 51242 | 44140 |
Compare specifications (specs)
| AMD EPYC 7302 | Intel Xeon Gold 6230 | |
|---|---|---|
Essentials |
||
| Architecture codename | Zen 2 | Cascade Lake |
| Launch date | 7 Aug 2019 | 2 April 2019 |
| Launch price (MSRP) | $978 | $1894, $1900 |
| OPN PIB | 100-100000043WOF | |
| OPN Tray | 100-000000043 | |
| Place in performance rating | 688 | 676 |
| Vertical segment | Server | Server |
| Family | Xeon Gold | |
| Processor Number | 6230 | |
| Series | 6200 | |
Performance |
||
| Base frequency | 3.0 GHz | 2.10 GHz |
| L1 cache | 1 MB | 1.25 MB |
| L2 cache | 8 MB | 20 MB |
| L3 cache | 128 MB | 27.5 MB |
| Manufacturing process technology | 7 nm, 14 nm | 14 nm |
| Maximum frequency | 3.3 GHz | 3.90 GHz |
| Number of cores | 16 | 20 |
| Number of threads | 32 | 40 |
| Unlocked | ||
| 64 bit support | ||
| Bus Speed | 4 × 8 GT/s | |
| Maximum case temperature (TCase) | 87 °C | |
| Number of Ultra Path Interconnect (UPI) Links | 3 | |
Memory |
||
| ECC memory support | ||
| Max memory channels | 8 | 6 |
| Maximum memory bandwidth | 204.8 GB/s | 131.13 GB/s |
| Maximum memory size | 4 TB | 1 TB |
| Supported memory types | DDR4-3200 | DDR4-2933 |
| Supported memory frequency | 2933 MHz | |
Compatibility |
||
| Socket Count | 1P/2P | |
| Sockets supported | SP3 | FCLGA3647 |
| Thermal Design Power (TDP) | 155 Watt | 125 Watt |
Peripherals |
||
| Max number of PCIe lanes | 128 | 48 |
| PCI Express revision | 4.0 | 3.0 |
| PCIe configurations | x16, x8 | |
| Scalability | 4S | |
Advanced Technologies |
||
| AMD SenseMI | ||
| Fused Multiply-Add 3 (FMA3) | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® Advanced Vector Extensions 2 (AVX2) | ||
| Intel® AES New Instructions | ||
| Enhanced Intel SpeedStep® technology | ||
| Instruction set extensions | Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512 | |
| Intel 64 | ||
| Intel® Hyper-Threading technology | ||
| Intel® Optane™ Memory Supported | ||
| Intel® TSX-NI | ||
| Intel® Turbo Boost technology | ||
| Intel® Volume Management Device (VMD) | ||
| Intel® vPro™ Platform Eligibility | ||
| Speed Shift technology | ||
| Turbo Boost Max 3.0 | ||
Virtualization |
||
| AMD Virtualization (AMD-V™) | ||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Run Sure Technology | ||
| Intel® Trusted Execution technology (TXT) | ||
| Mode-based Execute Control (MBE) | ||