AMD EPYC 7343 vs Intel Xeon E5-2418L v3

Comparative analysis of AMD EPYC 7343 and Intel Xeon E5-2418L v3 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD EPYC 7343

  • 10 more cores, run more applications at once: 16 vs 6
  • 20 more threads: 32 vs 12
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm+ vs 22 nm
  • 10.7x more maximum memory size: 4 TB vs 384 GB
Number of cores 16 vs 6
Number of threads 32 vs 12
Manufacturing process technology 7 nm+ vs 22 nm
Maximum memory size 4 TB vs 384 GB

Reasons to consider the Intel Xeon E5-2418L v3

  • 3.8x lower typical power consumption: 50 Watt vs 190 Watt
Thermal Design Power (TDP) 50 Watt vs 190 Watt

Compare benchmarks

CPU 1: AMD EPYC 7343
CPU 2: Intel Xeon E5-2418L v3

Name AMD EPYC 7343 Intel Xeon E5-2418L v3
PassMark - Single thread mark 2852
PassMark - CPU mark 73010

Compare specifications (specs)

AMD EPYC 7343 Intel Xeon E5-2418L v3

Essentials

Architecture codename Zen 3 Haswell
Launch date 15 Mar 2021 Q1'15
Launch price (MSRP) $1565
OPN PIB 100-100000338WOF
OPN Tray 100-000000338
Place in performance rating 158 not rated
Vertical segment Server Embedded
Processor Number E5-2418LV3
Series Intel® Xeon® Processor E5 v3 Family
Status Launched

Performance

Base frequency 3.2 GHz 2.00 GHz
L1 cache 1 MB
L2 cache 8 MB
L3 cache 128 MB
Manufacturing process technology 7 nm+ 22 nm
Maximum frequency 3.9 GHz
Number of cores 16 6
Number of threads 32 12
Unlocked
64 bit support
Bus Speed 6.4 GT/s QPI
Maximum core temperature 93
Number of QPI Links 1
VID voltage range 0.65V–1.30V

Memory

ECC memory support
Max memory channels 8 3
Maximum memory bandwidth 190.73 GB/s 51.2 GB/s
Maximum memory size 4 TB 384 GB
Supported memory types DDR4-3200 DDR3 800/1066/1333/1600

Compatibility

Configurable TDP 165-200 Watt
Socket Count 1P/2P
Sockets supported SP3 FCLGA1356
Thermal Design Power (TDP) 190 Watt 50 Watt
Low Halogen Options Available
Max number of CPUs in a configuration 2
Package Size 42.5mmx45mm

Peripherals

Max number of PCIe lanes 128 24
PCI Express revision 4.0 3.0
PCIe configurations x4, x8, x16
Scalability 2S

Advanced Technologies

AMD SenseMI
Fused Multiply-Add 3 (FMA3)
Intel® Advanced Vector Extensions (AVX)
Intel® Advanced Vector Extensions 2 (AVX2)
Intel® AES New Instructions
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® AVX
Intel 64
Intel® Demand Based Switching
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® TSX-NI
Intel® Turbo Boost technology
Physical Address Extensions (PAE) 46-bit
Thermal Monitoring

Virtualization

AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)