AMD EPYC 7401 vs AMD Opteron 4332 HE

Comparative analysis of AMD EPYC 7401 and AMD Opteron 4332 HE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Virtualization, Advanced Technologies. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD EPYC 7401

  • Processor is unlocked, an unlocked multiplier allows for easier overclocking
  • 18 more cores, run more applications at once: 24 vs 6
  • 42 more threads: 48 vs 6
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 32 nm
  • 8x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 2x more L2 cache, more data can be stored in the L2 cache for quick access later
  • 8x more L3 cache, more data can be stored in the L3 cache for quick access later
Unlocked Unlocked vs Locked
Number of cores 24 vs 6
Number of threads 48 vs 6
Manufacturing process technology 14 nm vs 32 nm
L1 cache 96 KB (per core) vs 288 KB
L2 cache 512 KB (per core) vs 6 MB
L3 cache 64 MB vs 8 MB

Reasons to consider the AMD Opteron 4332 HE

  • Around 23% higher clock speed: 3.7 GHz vs 3 GHz
  • 2.6x lower typical power consumption: 65 Watt vs 155/170 Watt
Maximum frequency 3.7 GHz vs 3 GHz
Thermal Design Power (TDP) 65 Watt vs 155/170 Watt

Compare benchmarks

CPU 1: AMD EPYC 7401
CPU 2: AMD Opteron 4332 HE

Name AMD EPYC 7401 AMD Opteron 4332 HE
Geekbench 4 - Single Core 3541
Geekbench 4 - Multi-Core 24681
PassMark - Single thread mark 1285
PassMark - CPU mark 5614

Compare specifications (specs)

AMD EPYC 7401 AMD Opteron 4332 HE

Essentials

Architecture codename Zen Seoul
Family AMD EPYC AMD Opteron
Launch date June 2017 n/d
Place in performance rating 4 11
Series AMD EPYC 7000 Series AMD Opteron 4300 Series Processor
Vertical segment Server Server
OPN Tray OS4332OFU6KHK

Performance

64 bit support
Base frequency 2 GHz 3 GHz
Die size 192 mm 315 mm
L1 cache 96 KB (per core) 288 KB
L2 cache 512 KB (per core) 6 MB
L3 cache 64 MB 8 MB
Manufacturing process technology 14 nm 32 nm
Maximum frequency 3 GHz 3.7 GHz
Number of cores 24 6
Number of threads 48 6
Transistor count 4800 million 1200 million
Unlocked
Maximum core temperature 68°C

Memory

Max memory channels 8
Maximum memory bandwidth 307/341 GB/s
Supported memory frequency 2400/2666 MHz 2000 MHz
Supported memory types DDR4 DDR3

Compatibility

Max number of CPUs in a configuration 2 2
Socket Count 1P/2P
Sockets supported TR4 C32
Thermal Design Power (TDP) 155/170 Watt 65 Watt

Peripherals

PCI Express revision x128

Virtualization

AMD Virtualization (AMD-V™)

Advanced Technologies

Fused Multiply-Add (FMA)
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions