AMD EPYC 7552 vs Intel Xeon Gold 6143
Comparative analysis of AMD EPYC 7552 and Intel Xeon Gold 6143 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD EPYC 7552
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- 32 more cores, run more applications at once: 48 vs 16
- 64 more threads: 96 vs 32
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 14 nm
- Around 3% lower typical power consumption: 200 Watt vs 205 Watt
- Around 55% better performance in PassMark - CPU mark: 72235 vs 46473
Specifications (specs) | |
Unlocked | Unlocked vs Locked |
Number of cores | 48 vs 16 |
Number of threads | 96 vs 32 |
Manufacturing process technology | 7 nm vs 14 nm |
Thermal Design Power (TDP) | 200 Watt vs 205 Watt |
Benchmarks | |
PassMark - CPU mark | 72235 vs 46473 |
Reasons to consider the Intel Xeon Gold 6143
- Around 19% higher clock speed: 4.00 GHz vs 3.35 GHz
- Around 57% better performance in PassMark - Single thread mark: 2392 vs 1527
Specifications (specs) | |
Maximum frequency | 4.00 GHz vs 3.35 GHz |
Benchmarks | |
PassMark - Single thread mark | 2392 vs 1527 |
Compare benchmarks
CPU 1: AMD EPYC 7552
CPU 2: Intel Xeon Gold 6143
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD EPYC 7552 | Intel Xeon Gold 6143 |
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PassMark - Single thread mark | 1527 | 2392 |
PassMark - CPU mark | 72235 | 46473 |
Compare specifications (specs)
AMD EPYC 7552 | Intel Xeon Gold 6143 | |
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Essentials |
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Architecture codename | Zen 2 | Skylake |
Launch date | 7 Aug 2019 | Q3'17 |
Place in performance rating | 509 | 479 |
Processor Number | 6143 | |
Series | Intel Xeon Scalable Processors | |
Status | Launched | |
Vertical segment | Server | |
Performance |
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Base frequency | 2.2 GHz | 2.80 GHz |
Die size | 74 mm² | |
L1 cache | 4.5 MB | |
L2 cache | 24 MB | |
L3 cache | 192 MB | |
Manufacturing process technology | 7 nm | 14 nm |
Maximum frequency | 3.35 GHz | 4.00 GHz |
Number of cores | 48 | 16 |
Number of threads | 96 | 32 |
Transistor count | 3800 million | |
Unlocked | ||
Maximum core temperature | 74°C | |
Number of Ultra Path Interconnect (UPI) Links | 3 | |
Memory |
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ECC memory support | ||
Max memory channels | 8 | 6 |
Supported memory types | DDR4-3200 | DDR4-2666 |
Maximum memory size | 768 GB | |
Supported memory frequency | 2666 MHz | |
Compatibility |
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Max number of CPUs in a configuration | 2 | |
Sockets supported | SP3 | FCLGA3647 |
Thermal Design Power (TDP) | 200 Watt | 205 Watt |
Package Size | 76.0mm x 56.5mm | |
Peripherals |
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PCI Express revision | 4.0 | 3.0 |
Max number of PCIe lanes | 48 | |
Scalability | S4S | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Run Sure Technology | ||
Intel® Trusted Execution technology (TXT) | ||
Mode-based Execute Control (MBE) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Instruction set extensions | Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® Volume Management Device (VMD) | ||
Intel® vPro™ Platform Eligibility | ||
Number of AVX-512 FMA Units | 2 | |
Speed Shift technology | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |