AMD EPYC 8224P vs Intel Xeon Platinum 8260

Comparative analysis of AMD EPYC 8224P and Intel Xeon Platinum 8260 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD EPYC 8224P

  • CPU is newer: launch date 4 year(s) 9 month(s) later
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 14 nm
  • Around 79% more L3 cache; more data can be stored in the L3 cache for quick access later
  • Around 3% lower typical power consumption: 160 Watt vs 165 Watt
  • Around 12% better performance in PassMark - Single thread mark: 2337 vs 2095
Specifications (specs)
Launch date 18 Sep 2023 vs 11 Dec 2018
Manufacturing process technology 5 nm vs 14 nm
L3 cache 64 MB (shared) vs 35.75 MB
Thermal Design Power (TDP) 160 Watt vs 165 Watt
Benchmarks
PassMark - Single thread mark 2337 vs 2095

Reasons to consider the Intel Xeon Platinum 8260

  • Around 30% higher clock speed: 3.90 GHz vs 3 GHz
  • Around 17% better performance in PassMark - CPU mark: 52668 vs 45180
Specifications (specs)
Maximum frequency 3.90 GHz vs 3 GHz
Benchmarks
PassMark - CPU mark 52668 vs 45180

Compare benchmarks

CPU 1: AMD EPYC 8224P
CPU 2: Intel Xeon Platinum 8260

PassMark - Single thread mark
CPU 1
CPU 2
2337
2095
PassMark - CPU mark
CPU 1
CPU 2
45180
52668
Name AMD EPYC 8224P Intel Xeon Platinum 8260
PassMark - Single thread mark 2337 2095
PassMark - CPU mark 45180 52668

Compare specifications (specs)

AMD EPYC 8224P Intel Xeon Platinum 8260

Essentials

Launch date 18 Sep 2023 11 Dec 2018
Launch price (MSRP) $855 $5383
Place in performance rating 586 602
Architecture codename Cascade Lake
Processor Number 8260
Series 2nd Generation Intel Xeon Scalable Processors
Vertical segment Server

Performance

Base frequency 2.55 GHz 2.40 GHz
Die size 2x 73 mm²
L1 cache 64 KB (per core) 1.5 MB
L2 cache 1 MB (per core) 24 MB
L3 cache 64 MB (shared) 35.75 MB
Manufacturing process technology 5 nm 14 nm
Maximum case temperature (TCase) 75°C
Maximum frequency 3 GHz 3.90 GHz
Number of cores 24 24
Number of threads 48 48
Transistor count 17,750 million
Unlocked
Maximum core temperature 90°C

Memory

ECC memory support
Supported memory types DDR5 DDR4-2933
Max memory channels 6
Maximum memory size 1 TB
Supported memory frequency 2933 MHz

Compatibility

Configurable TDP 155-225 Watt
Max number of CPUs in a configuration 1
Sockets supported SP6 FCLGA3647
Thermal Design Power (TDP) 160 Watt 165 Watt
Package Size 76.0mm x 56.5mm

Peripherals

PCIe configurations Gen 5, 96 Lanes, (CPU only)
Max number of PCIe lanes 48
PCI Express revision 3.0
Scalability S8S

Security & Reliability

Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Instruction set extensions Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Number of AVX-512 FMA Units 2
Speed Shift technology

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)