AMD EPYC 8324P vs AMD EPYC 7352

Comparative analysis of AMD EPYC 8324P and AMD EPYC 7352 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD EPYC 8324P

AMD EPYC 7352

Differences

Reasons to consider the AMD EPYC 8324P

CPU is newer: launch date 4 year(s) 1 month(s) later
8 more cores, run more applications at once: 32 vs 24
16 more threads: 64 vs 48
A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 7 nm, 14 nm
Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
2.7x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 16% better performance in PassMark - Single thread mark: 2367 vs 2040

Specifications (specs)
Launch date	18 Sep 2023 vs 7 Aug 2019
Number of cores	32 vs 24
Number of threads	64 vs 48
Manufacturing process technology	5 nm vs 7 nm, 14 nm
L1 cache	64 KB (per core) vs 1.5 MB
L2 cache	1 MB (per core) vs 12 MB
Benchmarks
PassMark - Single thread mark	2367 vs 2040

Reasons to consider the AMD EPYC 7352

Around 7% higher clock speed: 3.2 GHz vs 3 GHz
Around 16% lower typical power consumption: 155 Watt vs 180 Watt
Around 15% better performance in PassMark - CPU mark: 65921 vs 57127

Specifications (specs)
Maximum frequency	3.2 GHz vs 3 GHz
Max number of CPUs in a configuration	2 vs 1
Thermal Design Power (TDP)	155 Watt vs 180 Watt
Benchmarks
PassMark - CPU mark	65921 vs 57127

Compare benchmarks

CPU 1: AMD EPYC 8324P
CPU 2: AMD EPYC 7352

PassMark - Single thread mark

CPU 1

CPU 2

2367

2040

PassMark - CPU mark

CPU 1

CPU 2

57127

65921

Name	AMD EPYC 8324P	AMD EPYC 7352
PassMark - Single thread mark	2367	2040
PassMark - CPU mark	57127	65921

Compare specifications (specs)

	AMD EPYC 8324P	AMD EPYC 7352
Essentials
Launch date	18 Sep 2023	7 Aug 2019
Launch price (MSRP)	$1895	$1350
Place in performance rating	351	368
Architecture codename		Zen 2
OPN PIB		100-100000077WOF
OPN Tray		100-000000077
Vertical segment		Server
Performance
Base frequency	2.65 GHz	2.3 GHz
Die size	4x 73 mm²
L1 cache	64 KB (per core)	1.5 MB
L2 cache	1 MB (per core)	12 MB
L3 cache	128 MB (shared)	128 MB
Manufacturing process technology	5 nm	7 nm, 14 nm
Maximum case temperature (TCase)	75°C
Maximum frequency	3 GHz	3.2 GHz
Number of cores	32	24
Number of threads	64	48
Transistor count	35,500 million
Unlocked
Memory
ECC memory support
Supported memory types	DDR5	DDR4-3200
Max memory channels		8
Maximum memory bandwidth		190.7 GB/s
Maximum memory size		4 TB
Compatibility
Configurable TDP	155-225 Watt
Max number of CPUs in a configuration	1	2
Sockets supported	SP6	SP3
Thermal Design Power (TDP)	180 Watt	155 Watt
Socket Count		1P/2P
Peripherals
PCIe configurations	Gen 5, 96 Lanes, (CPU only)	x16, x8
Max number of PCIe lanes		128
PCI Express revision		4.0