AMD EPYC 8324P vs AMD EPYC 7352
Comparative analysis of AMD EPYC 8324P and AMD EPYC 7352 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD EPYC 8324P
- CPU is newer: launch date 4 year(s) 1 month(s) later
- 8 more cores, run more applications at once: 32 vs 24
- 16 more threads: 64 vs 48
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 7 nm, 14 nm
- Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
- 2.7x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 16% better performance in PassMark - Single thread mark: 2367 vs 2040
Specifications (specs) | |
Launch date | 18 Sep 2023 vs 7 Aug 2019 |
Number of cores | 32 vs 24 |
Number of threads | 64 vs 48 |
Manufacturing process technology | 5 nm vs 7 nm, 14 nm |
L1 cache | 64 KB (per core) vs 1.5 MB |
L2 cache | 1 MB (per core) vs 12 MB |
Benchmarks | |
PassMark - Single thread mark | 2367 vs 2040 |
Reasons to consider the AMD EPYC 7352
- Around 7% higher clock speed: 3.2 GHz vs 3 GHz
- Around 16% lower typical power consumption: 155 Watt vs 180 Watt
- Around 15% better performance in PassMark - CPU mark: 65921 vs 57127
Specifications (specs) | |
Maximum frequency | 3.2 GHz vs 3 GHz |
Max number of CPUs in a configuration | 2 vs 1 |
Thermal Design Power (TDP) | 155 Watt vs 180 Watt |
Benchmarks | |
PassMark - CPU mark | 65921 vs 57127 |
Compare benchmarks
CPU 1: AMD EPYC 8324P
CPU 2: AMD EPYC 7352
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD EPYC 8324P | AMD EPYC 7352 |
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PassMark - Single thread mark | 2367 | 2040 |
PassMark - CPU mark | 57127 | 65921 |
Compare specifications (specs)
AMD EPYC 8324P | AMD EPYC 7352 | |
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Essentials |
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Launch date | 18 Sep 2023 | 7 Aug 2019 |
Launch price (MSRP) | $1895 | $1350 |
Place in performance rating | 364 | 381 |
Architecture codename | Zen 2 | |
OPN PIB | 100-100000077WOF | |
OPN Tray | 100-000000077 | |
Vertical segment | Server | |
Performance |
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Base frequency | 2.65 GHz | 2.3 GHz |
Die size | 4x 73 mm² | |
L1 cache | 64 KB (per core) | 1.5 MB |
L2 cache | 1 MB (per core) | 12 MB |
L3 cache | 128 MB (shared) | 128 MB |
Manufacturing process technology | 5 nm | 7 nm, 14 nm |
Maximum case temperature (TCase) | 75°C | |
Maximum frequency | 3 GHz | 3.2 GHz |
Number of cores | 32 | 24 |
Number of threads | 64 | 48 |
Transistor count | 35,500 million | |
Unlocked | ||
Memory |
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ECC memory support | ||
Supported memory types | DDR5 | DDR4-3200 |
Max memory channels | 8 | |
Maximum memory bandwidth | 190.7 GB/s | |
Maximum memory size | 4 TB | |
Compatibility |
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Configurable TDP | 155-225 Watt | |
Max number of CPUs in a configuration | 1 | 2 |
Sockets supported | SP6 | SP3 |
Thermal Design Power (TDP) | 180 Watt | 155 Watt |
Socket Count | 1P/2P | |
Peripherals |
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PCIe configurations | Gen 5, 96 Lanes, (CPU only) | x16, x8 |
Max number of PCIe lanes | 128 | |
PCI Express revision | 4.0 |