AMD EPYC 8324P vs AMD EPYC 7352

Comparative analysis of AMD EPYC 8324P and AMD EPYC 7352 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD EPYC 8324P

  • CPU is newer: launch date 4 year(s) 1 month(s) later
  • 8 more cores, run more applications at once: 32 vs 24
  • 16 more threads: 64 vs 48
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 7 nm, 14 nm
  • Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
  • 2.7x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 16% better performance in PassMark - Single thread mark: 2367 vs 2040
Specifications (specs)
Launch date 18 Sep 2023 vs 7 Aug 2019
Number of cores 32 vs 24
Number of threads 64 vs 48
Manufacturing process technology 5 nm vs 7 nm, 14 nm
L1 cache 64 KB (per core) vs 1.5 MB
L2 cache 1 MB (per core) vs 12 MB
Benchmarks
PassMark - Single thread mark 2367 vs 2040

Reasons to consider the AMD EPYC 7352

  • Around 7% higher clock speed: 3.2 GHz vs 3 GHz
  • Around 16% lower typical power consumption: 155 Watt vs 180 Watt
  • Around 15% better performance in PassMark - CPU mark: 65921 vs 57127
Specifications (specs)
Maximum frequency 3.2 GHz vs 3 GHz
Max number of CPUs in a configuration 2 vs 1
Thermal Design Power (TDP) 155 Watt vs 180 Watt
Benchmarks
PassMark - CPU mark 65921 vs 57127

Compare benchmarks

CPU 1: AMD EPYC 8324P
CPU 2: AMD EPYC 7352

PassMark - Single thread mark
CPU 1
CPU 2
2367
2040
PassMark - CPU mark
CPU 1
CPU 2
57127
65921
Name AMD EPYC 8324P AMD EPYC 7352
PassMark - Single thread mark 2367 2040
PassMark - CPU mark 57127 65921

Compare specifications (specs)

AMD EPYC 8324P AMD EPYC 7352

Essentials

Launch date 18 Sep 2023 7 Aug 2019
Launch price (MSRP) $1895 $1350
Place in performance rating 366 382
Architecture codename Zen 2
OPN PIB 100-100000077WOF
OPN Tray 100-000000077
Vertical segment Server

Performance

Base frequency 2.65 GHz 2.3 GHz
Die size 4x 73 mm²
L1 cache 64 KB (per core) 1.5 MB
L2 cache 1 MB (per core) 12 MB
L3 cache 128 MB (shared) 128 MB
Manufacturing process technology 5 nm 7 nm, 14 nm
Maximum case temperature (TCase) 75°C
Maximum frequency 3 GHz 3.2 GHz
Number of cores 32 24
Number of threads 64 48
Transistor count 35,500 million
Unlocked

Memory

ECC memory support
Supported memory types DDR5 DDR4-3200
Max memory channels 8
Maximum memory bandwidth 190.7 GB/s
Maximum memory size 4 TB

Compatibility

Configurable TDP 155-225 Watt
Max number of CPUs in a configuration 1 2
Sockets supported SP6 SP3
Thermal Design Power (TDP) 180 Watt 155 Watt
Socket Count 1P/2P

Peripherals

PCIe configurations Gen 5, 96 Lanes, (CPU only) x16, x8
Max number of PCIe lanes 128
PCI Express revision 4.0