AMD Opteron 3260 HE vs Intel Xeon E5-1620 v2
Comparative analysis of AMD Opteron 3260 HE and Intel Xeon E5-1620 v2 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the AMD Opteron 3260 HE
- 4x more L2 cache, more data can be stored in the L2 cache for quick access later
- 2.9x lower typical power consumption: 45 Watt vs 130 Watt
L2 cache | 4 MB vs 256 KB (per core) |
Thermal Design Power (TDP) | 45 Watt vs 130 Watt |
Reasons to consider the Intel Xeon E5-1620 v2
- 4 more threads: 8 vs 4
- Around 5% higher clock speed: 3.90 GHz vs 3.7 GHz
- Around 15% higher maximum core temperature: 70°C vs 61.10°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
- Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
- 2.5x more L3 cache, more data can be stored in the L3 cache for quick access later
- 2.2x better performance in PassMark - Single thread mark: 2022 vs 900
- 2.9x better performance in PassMark - CPU mark: 6549 vs 2283
Specifications (specs) | |
Number of threads | 8 vs 4 |
Maximum frequency | 3.90 GHz vs 3.7 GHz |
Maximum core temperature | 70°C vs 61.10°C |
Manufacturing process technology | 22 nm vs 32 nm |
L1 cache | 64 KB (per core) vs 192 KB |
L3 cache | 10240 KB (shared) vs 4 MB |
Benchmarks | |
PassMark - Single thread mark | 2022 vs 900 |
PassMark - CPU mark | 6549 vs 2283 |
Compare benchmarks
CPU 1: AMD Opteron 3260 HE
CPU 2: Intel Xeon E5-1620 v2
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Opteron 3260 HE | Intel Xeon E5-1620 v2 |
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PassMark - Single thread mark | 900 | 2022 |
PassMark - CPU mark | 2283 | 6549 |
Geekbench 4 - Single Core | 771 | |
Geekbench 4 - Multi-Core | 3220 | |
3DMark Fire Strike - Physics Score | 0 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 4.986 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 86.752 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.613 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 2.351 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 6.181 |
Compare specifications (specs)
AMD Opteron 3260 HE | Intel Xeon E5-1620 v2 | |
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Essentials |
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Family | AMD Opteron | |
OPN PIB | OS3260HOW4MGUBOX | |
OPN Tray | OS3260HOW4MGU | |
Place in performance rating | 2354 | 2281 |
Series | AMD Opteron 3200 Series Processor | Intel® Xeon® Processor E5 v2 Family |
Vertical segment | Server | Server |
Architecture codename | Ivy Bridge EP | |
Launch date | September 2013 | |
Launch price (MSRP) | $315 | |
Price now | $329 | |
Processor Number | E5-1620V2 | |
Status | Launched | |
Value for money (0-100) | 8.46 | |
Performance |
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Base frequency | 2.7 GHz | 3.70 GHz |
L1 cache | 192 KB | 64 KB (per core) |
L2 cache | 4 MB | 256 KB (per core) |
L3 cache | 4 MB | 10240 KB (shared) |
Manufacturing process technology | 32 nm | 22 nm |
Maximum core temperature | 61.10°C | 70°C |
Maximum frequency | 3.7 GHz | 3.90 GHz |
Number of cores | 4 | 4 |
Number of threads | 4 | 8 |
Unlocked | ||
64 bit support | ||
Bus Speed | 0 GT/s QPI | |
Die size | 160 mm | |
Number of QPI Links | 0 | |
Transistor count | 1400 million | |
VID voltage range | 0.65–1.30V | |
Memory |
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Supported memory frequency | 2000 MHz | |
Supported memory types | DDR3 | DDR3 800/1066/1333/1600/1866 |
ECC memory support | ||
Max memory channels | 4 | |
Maximum memory bandwidth | 59.7 GB/s | |
Maximum memory size | 256 GB | |
Compatibility |
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Sockets supported | AM3+ | FCLGA2011 |
Thermal Design Power (TDP) | 45 Watt | 130 Watt |
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | 52.5mm x 45.0 mm | |
Peripherals |
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Max number of PCIe lanes | 40 | |
PCI Express revision | 3.0 | |
PCIe configurations | x4, x8, x16 | |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® AVX | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |