AMD Opteron 6168 vs Intel Xeon L5609

Comparative analysis of AMD Opteron 6168 and Intel Xeon L5609 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD Opteron 6168

  • 8 more cores, run more applications at once: 12 vs 4
  • Around 2% higher clock speed: 1.9 GHz vs 1.86 GHz
  • 3x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 72x more L2 cache, more data can be stored in the L2 cache for quick access later
  • 4.8x better performance in PassMark - CPU mark: 15745 vs 3298
Specifications (specs)
Number of cores 12 vs 4
Maximum frequency 1.9 GHz vs 1.86 GHz
L1 cache 768 KB (shared) vs 64 KB (per core)
L2 cache 6144 KB (per core) vs 256 KB (per core)
Benchmarks
PassMark - CPU mark 15745 vs 3298

Reasons to consider the Intel Xeon L5609

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
  • 2.9x lower typical power consumption: 40 Watt vs 115 Watt
  • Around 37% better performance in PassMark - Single thread mark: 1160 vs 845
Specifications (specs)
Manufacturing process technology 32 nm vs 45 nm
Thermal Design Power (TDP) 40 Watt vs 115 Watt
Benchmarks
PassMark - Single thread mark 1160 vs 845

Compare benchmarks

CPU 1: AMD Opteron 6168
CPU 2: Intel Xeon L5609

PassMark - Single thread mark
CPU 1
CPU 2
845
1160
PassMark - CPU mark
CPU 1
CPU 2
15745
3298
Name AMD Opteron 6168 Intel Xeon L5609
PassMark - Single thread mark 845 1160
PassMark - CPU mark 15745 3298

Compare specifications (specs)

AMD Opteron 6168 Intel Xeon L5609

Essentials

Architecture codename Magny-Cours Westmere EP
Launch date March 2010 March 2010
Place in performance rating 2039 2058
Vertical segment Server Server
Processor Number L5609
Series Legacy Intel® Xeon® Processors
Status Discontinued

Performance

64 bit support
Die size 346 mm 239 mm
L1 cache 768 KB (shared) 64 KB (per core)
L2 cache 6144 KB (per core) 256 KB (per core)
L3 cache 12288 KB 12288 KB (shared)
Manufacturing process technology 45 nm 32 nm
Maximum case temperature (TCase) 69 °C
Maximum frequency 1.9 GHz 1.86 GHz
Number of cores 12 4
Transistor count 1800 million 1170 million
Base frequency 1.86 GHz
Bus Speed 4.8 GT/s QPI
Maximum core temperature 63.1°C
Number of QPI Links 2
Number of threads 4
VID voltage range 0.750V-1.350V

Memory

Supported memory types DDR3 DDR3 800/1066
ECC memory support
Max memory channels 3
Maximum memory bandwidth 25.6 GB/s
Maximum memory size 288 GB

Compatibility

Max number of CPUs in a configuration 2 2
Sockets supported G34 FCLGA1366
Thermal Design Power (TDP) 115 Watt 40 Watt
Low Halogen Options Available
Package Size 42.5mm x 45mm

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE) 40-bit
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)