AMD Phenom II X4 970 BE vs Intel Core i3-560
Comparative analysis of AMD Phenom II X4 970 BE and Intel Core i3-560 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Graphics, Graphics interfaces, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s).
Differences
Reasons to consider the AMD Phenom II X4 970 BE
- CPU is newer: launch date 1 month(s) later
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- 2 more cores, run more applications at once: 4 vs 2
- Around 5% higher clock speed: 3.5 GHz vs 3.33 GHz
- 4x more L1 cache, more data can be stored in the L1 cache for quick access later
- 4x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 50% more L3 cache; more data can be stored in the L3 cache for quick access later
- Around 5% better performance in PassMark - Single thread mark: 1417 vs 1352
- Around 68% better performance in PassMark - CPU mark: 2739 vs 1627
- Around 24% better performance in Geekbench 4 - Multi-Core: 1485 vs 1200
- 2.7x better performance in CompuBench 1.5 Desktop - Face Detection (mPixels/s): 1.62 vs 0.611
- Around 17% better performance in CompuBench 1.5 Desktop - T-Rex (Frames/s): 0.204 vs 0.174
Specifications (specs) | |
Launch date | September 2010 vs August 2010 |
Unlocked | Unlocked vs Locked |
Number of cores | 4 vs 2 |
Maximum frequency | 3.5 GHz vs 3.33 GHz |
L1 cache | 128 KB (per core) vs 64 KB (per core) |
L2 cache | 512 KB (per core) vs 256 KB (per core) |
L3 cache | 6144 KB (shared) vs 4096 KB (shared) |
Benchmarks | |
PassMark - Single thread mark | 1417 vs 1352 |
PassMark - CPU mark | 2739 vs 1627 |
Geekbench 4 - Multi-Core | 1485 vs 1200 |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 1.62 vs 0.611 |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.204 vs 0.174 |
Reasons to consider the Intel Core i3-560
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
- Around 71% lower typical power consumption: 73 Watt vs 125 Watt
- Around 24% better performance in Geekbench 4 - Single Core: 542 vs 437
- 2.7x better performance in CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s): 32.532 vs 12.098
Specifications (specs) | |
Manufacturing process technology | 32 nm vs 45 nm |
Thermal Design Power (TDP) | 73 Watt vs 125 Watt |
Benchmarks | |
Geekbench 4 - Single Core | 542 vs 437 |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 32.532 vs 12.098 |
Compare benchmarks
CPU 1: AMD Phenom II X4 970 BE
CPU 2: Intel Core i3-560
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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CompuBench 1.5 Desktop - Face Detection (mPixels/s) |
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CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) |
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CompuBench 1.5 Desktop - T-Rex (Frames/s) |
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Name | AMD Phenom II X4 970 BE | Intel Core i3-560 |
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PassMark - Single thread mark | 1417 | 1352 |
PassMark - CPU mark | 2739 | 1627 |
Geekbench 4 - Single Core | 437 | 542 |
Geekbench 4 - Multi-Core | 1485 | 1200 |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 1.62 | 0.611 |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 12.098 | 32.532 |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.204 | 0.174 |
Compare specifications (specs)
AMD Phenom II X4 970 BE | Intel Core i3-560 | |
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Essentials |
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Architecture codename | Deneb | Clarkdale |
Launch date | September 2010 | August 2010 |
Place in performance rating | 2714 | 2715 |
Vertical segment | Desktop | Desktop |
Launch price (MSRP) | $190 | |
Price now | $29.98 | |
Processor Number | i3-560 | |
Series | Legacy Intel® Core™ Processors | |
Status | Discontinued | |
Value for money (0-100) | 28.90 | |
Performance |
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64 bit support | ||
Die size | 258 mm | 81 mm2 |
L1 cache | 128 KB (per core) | 64 KB (per core) |
L2 cache | 512 KB (per core) | 256 KB (per core) |
L3 cache | 6144 KB (shared) | 4096 KB (shared) |
Manufacturing process technology | 45 nm | 32 nm |
Maximum frequency | 3.5 GHz | 3.33 GHz |
Number of cores | 4 | 2 |
Transistor count | 758 million | 382 million |
Unlocked | ||
Base frequency | 3.33 GHz | |
Bus Speed | 2.5 GT/s DMI | |
Maximum core temperature | 72.6°C | |
Number of threads | 4 | |
VID voltage range | 0.6500V-1.4000V | |
Memory |
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Supported memory types | DDR3 | DDR3 1066/1333 |
Max memory channels | 2 | |
Maximum memory bandwidth | 21 GB/s | |
Maximum memory size | 16.38 GB | |
Compatibility |
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Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | AM3 | FCLGA1156 |
Thermal Design Power (TDP) | 125 Watt | 73 Watt |
Low Halogen Options Available | ||
Package Size | 37.5mm x 37.5mm | |
Graphics |
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Graphics base frequency | 733 MHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Processor graphics | Intel HD Graphics | |
Graphics interfaces |
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Number of displays supported | 2 | |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 2.0 | |
PCIe configurations | 1x16, 2x8 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Physical Address Extensions (PAE) | 36-bit | |
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® VT-x with Extended Page Tables (EPT) |