AMD Phenom X3 8450e vs Intel Pentium 4 HT 520
Comparative analysis of AMD Phenom X3 8450e and Intel Pentium 4 HT 520 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Virtualization, Memory, Security & Reliability, Advanced Technologies. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the AMD Phenom X3 8450e
- CPU is newer: launch date 4 year(s) 3 month(s) later
- 2 more cores, run more applications at once: 3 vs 1
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
- 24x more L1 cache, more data can be stored in the L1 cache for quick access later
- Around 50% more L2 cache; more data can be stored in the L2 cache for quick access later
- Around 29% lower typical power consumption: 65 Watt vs 84 Watt
| Launch date | September 2008 vs June 2004 |
| Number of cores | 3 vs 1 |
| Manufacturing process technology | 65 nm vs 90 nm |
| L1 cache | 128 KB (per core) vs 16 KB |
| L2 cache | 512 KB (per core) vs 1024 KB |
| Thermal Design Power (TDP) | 65 Watt vs 84 Watt |
Reasons to consider the Intel Pentium 4 HT 520
- Around 33% higher clock speed: 2.8 GHz vs 2.1 GHz
| Maximum frequency | 2.8 GHz vs 2.1 GHz |
Compare benchmarks
CPU 1: AMD Phenom X3 8450e
CPU 2: Intel Pentium 4 HT 520
| Name | AMD Phenom X3 8450e | Intel Pentium 4 HT 520 |
|---|---|---|
| PassMark - Single thread mark | 824 | |
| PassMark - CPU mark | 1206 | |
| Geekbench 4 - Single Core | 801 | |
| Geekbench 4 - Multi-Core | 906 |
Compare specifications (specs)
| AMD Phenom X3 8450e | Intel Pentium 4 HT 520 | |
|---|---|---|
Essentials |
||
| Architecture codename | Toliman | Prescott |
| Launch date | September 2008 | June 2004 |
| Place in performance rating | 2529 | 2532 |
| Vertical segment | Desktop | Desktop |
| Processor Number | 520 | |
| Series | Legacy Intel® Pentium® Processor | |
| Status | Discontinued | |
Performance |
||
| 64 bit support | ||
| Die size | 285 mm | 112 mm2 |
| L1 cache | 128 KB (per core) | 16 KB |
| L2 cache | 512 KB (per core) | 1024 KB |
| L3 cache | 2048 KB (shared) | |
| Manufacturing process technology | 65 nm | 90 nm |
| Maximum frequency | 2.1 GHz | 2.8 GHz |
| Number of cores | 3 | 1 |
| Transistor count | 450 million | 125 million |
| Base frequency | 2.80 GHz | |
| Bus Speed | 800 MHz FSB | |
| Maximum core temperature | 67.7°C | |
| VID voltage range | 1.200V-1.425V | |
Compatibility |
||
| Max number of CPUs in a configuration | 1 | 1 |
| Sockets supported | AM2+ | PLGA775 |
| Thermal Design Power (TDP) | 65 Watt | 84 Watt |
| Low Halogen Options Available | ||
| Package Size | 37.5mm x 37.5mm | |
Virtualization |
||
| AMD Virtualization (AMD-V™) | ||
| Intel® Virtualization Technology (VT-x) | ||
Memory |
||
| Supported memory types | DDR1, DDR2, DDR3 | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Intel 64 | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||