AMD Phenom X3 8750 vs Intel Pentium D 915
Comparative analysis of AMD Phenom X3 8750 and Intel Pentium D 915 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Virtualization, Memory, Security & Reliability, Advanced Technologies. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD Phenom X3 8750
- CPU is newer: launch date 1 year(s) 9 month(s) later
- 1 more cores, run more applications at once: 3 vs 2
- 13.7x more L1 cache, more data can be stored in the L1 cache for quick access later
- Around 64% better performance in Geekbench 4 - Single Core: 293 vs 179
- 2.6x better performance in Geekbench 4 - Multi-Core: 790 vs 307
Specifications (specs) | |
Launch date | April 2008 vs July 2006 |
Number of cores | 3 vs 2 |
L1 cache | 128 KB (per core) vs 28 KB |
Benchmarks | |
Geekbench 4 - Single Core | 293 vs 179 |
Geekbench 4 - Multi-Core | 790 vs 307 |
Reasons to consider the Intel Pentium D 915
- Around 17% higher clock speed: 2.8 GHz vs 2.4 GHz
- 2.7x more L2 cache, more data can be stored in the L2 cache for quick access later
Maximum frequency | 2.8 GHz vs 2.4 GHz |
L2 cache | 4096 KB vs 512 KB (per core) |
Max number of CPUs in a configuration | 2 vs 1 |
Compare benchmarks
CPU 1: AMD Phenom X3 8750
CPU 2: Intel Pentium D 915
Geekbench 4 - Single Core |
|
|
||||
Geekbench 4 - Multi-Core |
|
|
Name | AMD Phenom X3 8750 | Intel Pentium D 915 |
---|---|---|
Geekbench 4 - Single Core | 293 | 179 |
Geekbench 4 - Multi-Core | 790 | 307 |
PassMark - Single thread mark | 532 | |
PassMark - CPU mark | 465 |
Compare specifications (specs)
AMD Phenom X3 8750 | Intel Pentium D 915 | |
---|---|---|
Essentials |
||
Architecture codename | Toliman | Presler |
Launch date | April 2008 | July 2006 |
Place in performance rating | 3195 | 3183 |
Vertical segment | Desktop | Desktop |
Processor Number | 915 | |
Series | Legacy Intel® Pentium® Processor | |
Status | Discontinued | |
Performance |
||
64 bit support | ||
Die size | 285 mm | 162 mm2 |
L1 cache | 128 KB (per core) | 28 KB |
L2 cache | 512 KB (per core) | 4096 KB |
L3 cache | 2048 KB (shared) | |
Manufacturing process technology | 65 nm | 65 nm |
Maximum frequency | 2.4 GHz | 2.8 GHz |
Number of cores | 3 | 2 |
Transistor count | 450 million | 376 million |
Base frequency | 2.80 GHz | |
Bus Speed | 800 MHz FSB | |
Maximum core temperature | 63.4°C | |
VID voltage range | 1.200V-1.3375V | |
Compatibility |
||
Max number of CPUs in a configuration | 1 | 2 |
Sockets supported | AM2+ | PLGA775 |
Thermal Design Power (TDP) | 95 Watt | 95 Watt |
Low Halogen Options Available | ||
Package Size | 37.5mm x 37.5mm | |
Virtualization |
||
AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Memory |
||
Supported memory types | DDR1, DDR2, DDR3 | |
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Physical Address Extensions (PAE) | 32-bit | |
Thermal Monitoring |