AMD Ryzen 3 3100 vs Intel Celeron G1620

Comparative analysis of AMD Ryzen 3 3100 and Intel Celeron G1620 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics, Graphics interfaces, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).

AMD Ryzen 3 3100

Intel Celeron G1620

Differences

Reasons to consider the AMD Ryzen 3 3100

CPU is newer: launch date 7 year(s) 5 month(s) later
Processor is unlocked, an unlocked multiplier allows for easier overclocking
2 more cores, run more applications at once: 4 vs 2
6 more threads: 8 vs 2
Around 44% higher clock speed: 3.9 GHz vs 2.7 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 22 nm
2x more L1 cache, more data can be stored in the L1 cache for quick access later
4x more L2 cache, more data can be stored in the L2 cache for quick access later
8x more L3 cache, more data can be stored in the L3 cache for quick access later
Around 66% better performance in PassMark - Single thread mark: 2416 vs 1454
7.4x better performance in PassMark - CPU mark: 11565 vs 1571

Specifications (specs)
Launch date	7 May 2020 vs December 2012
Unlocked	Unlocked vs Locked
Number of cores	4 vs 2
Number of threads	8 vs 2
Maximum frequency	3.9 GHz vs 2.7 GHz
Manufacturing process technology	7 nm vs 22 nm
L1 cache	256 KB vs 64 KB (per core)
L2 cache	2 MB vs 256 KB (per core)
L3 cache	16 MB vs 2048 KB (shared)
Benchmarks
PassMark - Single thread mark	2416 vs 1454
PassMark - CPU mark	11565 vs 1571

Reasons to consider the Intel Celeron G1620

Around 18% lower typical power consumption: 55 Watt vs 65 Watt

Thermal Design Power (TDP)	55 Watt vs 65 Watt

Compare benchmarks

CPU 1: AMD Ryzen 3 3100
CPU 2: Intel Celeron G1620

PassMark - Single thread mark

CPU 1

CPU 2

2416

1454

PassMark - CPU mark

CPU 1

CPU 2

11565

1571

Name	AMD Ryzen 3 3100	Intel Celeron G1620
PassMark - Single thread mark	2416	1454
PassMark - CPU mark	11565	1571
3DMark Fire Strike - Physics Score	2987
Geekbench 4 - Single Core		470
Geekbench 4 - Multi-Core		878
CompuBench 1.5 Desktop - Face Detection (mPixels/s)		3.514
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)		19.177
CompuBench 1.5 Desktop - T-Rex (Frames/s)		0.19
CompuBench 1.5 Desktop - Video Composition (Frames/s)		0.878
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)		1.933
GFXBench 4.0 - T-Rex (Frames)		1528
GFXBench 4.0 - T-Rex (Fps)		1528

Compare specifications (specs)

	AMD Ryzen 3 3100	Intel Celeron G1620
Essentials
Architecture codename	Zen 2	Ivy Bridge
Launch date	7 May 2020	December 2012
Launch price (MSRP)	$99	$208
Place in performance rating	1223	2730
Vertical segment	Desktop	Desktop
Price now		$153.59
Processor Number		G1620
Series		Intel® Celeron® Processor G Series
Status		Launched
Value for money (0-100)		4.95
Performance
Base frequency	3.6 GHz	2.70 GHz
L1 cache	256 KB	64 KB (per core)
L2 cache	2 MB	256 KB (per core)
L3 cache	16 MB	2048 KB (shared)
Manufacturing process technology	7 nm	22 nm
Maximum frequency	3.9 GHz	2.7 GHz
Number of cores	4	2
Number of threads	8	2
Unlocked
64 bit support
Bus Speed		5 GT/s DMI
Die size		94 mm
Maximum case temperature (TCase)		65 °C
Memory
Supported memory types	DDR4-3200	DDR3 1333
ECC memory support
Max memory channels		2
Maximum memory bandwidth		21 GB/s
Maximum memory size		32 GB
Compatibility
Sockets supported	AM4	FCLGA1155
Thermal Design Power (TDP)	65 Watt	55 Watt
Low Halogen Options Available
Max number of CPUs in a configuration		1
Package Size		37.5mm x 37.5mm
Thermal Solution		2011C
Peripherals
PCI Express revision	4.0	2.0
PCIe configurations		up to 1x16, 2x8, 1x8 & 2x4
Scalability		1S Only
Graphics
Graphics base frequency		650 MHz
Graphics max dynamic frequency		1.05 GHz
Graphics max frequency		1.05 GHz
Intel® Clear Video HD technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics		Intel HD Graphics
Graphics interfaces
Number of displays supported		3
Wireless Display (WiDi) support
Security & Reliability
Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions		Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Optane™ Memory Supported
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)