AMD Ryzen 3 7335U vs AMD Ryzen 5 7530U
Comparative analysis of AMD Ryzen 3 7335U and AMD Ryzen 5 7530U processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD Ryzen 3 7335U
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 6 nm vs 7 nm
Manufacturing process technology | 6 nm vs 7 nm |
Reasons to consider the AMD Ryzen 5 7530U
- 2 more cores, run more applications at once: 6 vs 4
- 4 more threads: 12 vs 8
- Around 5% higher clock speed: 4.5 GHz vs 4.3 GHz
- Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
- Around 50% more L2 cache; more data can be stored in the L2 cache for quick access later
- 2x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 87% lower typical power consumption: 15 Watt vs 28 Watt
- Around 4% better performance in PassMark - Single thread mark: 3112 vs 2991
- Around 29% better performance in PassMark - CPU mark: 15977 vs 12401
Specifications (specs) | |
Number of cores | 6 vs 4 |
Number of threads | 12 vs 8 |
Maximum frequency | 4.5 GHz vs 4.3 GHz |
L1 cache | 384 KB vs 64 KB (per core) |
L2 cache | 3 MB vs 512 KB (per core) |
L3 cache | 16 MB vs 8 MB (shared) |
Thermal Design Power (TDP) | 15 Watt vs 28 Watt |
Benchmarks | |
PassMark - Single thread mark | 3112 vs 2991 |
PassMark - CPU mark | 15977 vs 12401 |
Compare benchmarks
CPU 1: AMD Ryzen 3 7335U
CPU 2: AMD Ryzen 5 7530U
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Ryzen 3 7335U | AMD Ryzen 5 7530U |
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PassMark - Single thread mark | 2991 | 3112 |
PassMark - CPU mark | 12401 | 15977 |
Compare specifications (specs)
AMD Ryzen 3 7335U | AMD Ryzen 5 7530U | |
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Essentials |
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Launch date | 4 Jan 2023 | 4 Jan 2023 |
Place in performance rating | 685 | 586 |
Architecture codename | Zen 3 | |
OPN Tray | 100-000000943 | |
Performance |
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Base frequency | 3 GHz | 2.5 GHz |
Die size | 208 mm² | 180 mm² |
L1 cache | 64 KB (per core) | 384 KB |
L2 cache | 512 KB (per core) | 3 MB |
L3 cache | 8 MB (shared) | 16 MB |
Manufacturing process technology | 6 nm | 7 nm |
Maximum core temperature | 95°C | 95 °C |
Maximum frequency | 4.3 GHz | 4.5 GHz |
Number of cores | 4 | 6 |
Number of threads | 8 | 12 |
Unlocked | ||
Transistor count | 10700 million | |
Memory |
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ECC memory support | ||
Supported memory types | DDR5 | DDR4-3200 |
Max memory channels | 2 | |
Compatibility |
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Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | FP7 | FP6 |
Thermal Design Power (TDP) | 28 Watt | 15 Watt |
Peripherals |
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PCIe configurations | Gen 4, 20 Lanes, (CPU only) | |
Max number of PCIe lanes | 16 | |
PCI Express revision | 3.0 | |
Graphics |
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Graphics max frequency | 2000 MHz |