AMD Ryzen 3 7335U vs AMD Ryzen 7 PRO 7730U

Comparative analysis of AMD Ryzen 3 7335U and AMD Ryzen 7 PRO 7730U processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD Ryzen 3 7335U

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 6 nm vs 7 nm
  • 524288x more L3 cache, more data can be stored in the L3 cache for quick access later
  • Around 1% better performance in PassMark - Single thread mark: 3040 vs 3005
Specifications (specs)
Manufacturing process technology 6 nm vs 7 nm
L3 cache 8 MB (shared) vs 16MB (shared)
Benchmarks
PassMark - Single thread mark 3040 vs 3005

Reasons to consider the AMD Ryzen 7 PRO 7730U

  • 4 more cores, run more applications at once: 8 vs 4
  • 8 more threads: 16 vs 8
  • Around 5% higher clock speed: 4.5 GHz vs 4.3 GHz
  • 2x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 2x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 87% lower typical power consumption: 15 Watt vs 28 Watt
  • Around 47% better performance in PassMark - CPU mark: 18507 vs 12556
Specifications (specs)
Number of cores 8 vs 4
Number of threads 16 vs 8
Maximum frequency 4.5 GHz vs 4.3 GHz
L1 cache 64K (per core) vs 64 KB (per core)
L2 cache 512K (per core) vs 512 KB (per core)
Thermal Design Power (TDP) 15 Watt vs 28 Watt
Benchmarks
PassMark - CPU mark 18507 vs 12556

Compare benchmarks

CPU 1: AMD Ryzen 3 7335U
CPU 2: AMD Ryzen 7 PRO 7730U

PassMark - Single thread mark
CPU 1
CPU 2
3040
3005
PassMark - CPU mark
CPU 1
CPU 2
12556
18507
Name AMD Ryzen 3 7335U AMD Ryzen 7 PRO 7730U
PassMark - Single thread mark 3040 3005
PassMark - CPU mark 12556 18507

Compare specifications (specs)

AMD Ryzen 3 7335U AMD Ryzen 7 PRO 7730U

Essentials

Launch date 4 Jan 2023 4 Jan 2023
Place in performance rating 661 597

Performance

Base frequency 3 GHz 2000 MHz
Die size 208 mm² 180 mm²
L1 cache 64 KB (per core) 64K (per core)
L2 cache 512 KB (per core) 512K (per core)
L3 cache 8 MB (shared) 16MB (shared)
Manufacturing process technology 6 nm 7 nm
Maximum core temperature 95°C 95°C
Maximum frequency 4.3 GHz 4.5 GHz
Number of cores 4 8
Number of threads 8 16
Unlocked
Transistor count 10,700 million

Memory

ECC memory support
Supported memory types DDR5 DDR4-3200 MHz, Dual-channel

Compatibility

Max number of CPUs in a configuration 1 1
Sockets supported FP7 FP6
Thermal Design Power (TDP) 28 Watt 15 Watt

Peripherals

PCIe configurations Gen 4, 20 Lanes, (CPU only) Gen 3, 16 Lanes, (CPU only)