AMD Ryzen 3 7335U vs AMD Ryzen 9 6900HS

Comparative analysis of AMD Ryzen 3 7335U and AMD Ryzen 9 6900HS processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.

AMD Ryzen 3 7335U

AMD Ryzen 9 6900HS

Differences

Reasons to consider the AMD Ryzen 3 7335U

CPU is newer: launch date 1 year(s) 0 month(s) later
Around 25% lower typical power consumption: 28 Watt vs 35 Watt

Launch date	4 Jan 2023 vs Jan 2022
Thermal Design Power (TDP)	28 Watt vs 35 Watt

Reasons to consider the AMD Ryzen 9 6900HS

4 more cores, run more applications at once: 8 vs 4
8 more threads: 16 vs 8
Around 14% higher clock speed: 4.9 GHz vs 4.3 GHz
2x more L1 cache, more data can be stored in the L1 cache for quick access later
2x more L2 cache, more data can be stored in the L2 cache for quick access later
2x more L3 cache, more data can be stored in the L3 cache for quick access later
Around 9% better performance in PassMark - Single thread mark: 3286 vs 3004
Around 89% better performance in PassMark - CPU mark: 23566 vs 12456

Specifications (specs)
Number of cores	8 vs 4
Number of threads	16 vs 8
Maximum frequency	4.9 GHz vs 4.3 GHz
L1 cache	512 KB vs 64 KB (per core)
L2 cache	4 MB vs 512 KB (per core)
L3 cache	16 MB vs 8 MB (shared)
Benchmarks
PassMark - Single thread mark	3286 vs 3004
PassMark - CPU mark	23566 vs 12456

Compare benchmarks

CPU 1: AMD Ryzen 3 7335U
CPU 2: AMD Ryzen 9 6900HS

PassMark - Single thread mark

CPU 1

CPU 2

3004

3286

PassMark - CPU mark

CPU 1

CPU 2

12456

23566

Name	AMD Ryzen 3 7335U	AMD Ryzen 9 6900HS
PassMark - Single thread mark	3004	3286
PassMark - CPU mark	12456	23566
3DMark Fire Strike - Physics Score		6900

Compare specifications (specs)

	AMD Ryzen 3 7335U	AMD Ryzen 9 6900HS
Essentials
Launch date	4 Jan 2023	Jan 2022
Place in performance rating	680	608
Architecture codename		Zen 3+
Vertical segment		Mobile
Performance
Base frequency	3 GHz	3.3 GHz
Die size	208 mm²	208 mm²
L1 cache	64 KB (per core)	512 KB
L2 cache	512 KB (per core)	4 MB
L3 cache	8 MB (shared)	16 MB
Manufacturing process technology	6 nm	6 nm
Maximum core temperature	95°C	95 °C
Maximum frequency	4.3 GHz	4.9 GHz
Number of cores	4	8
Number of threads	8	16
Unlocked
Memory
ECC memory support
Supported memory types	DDR5	DDR5-4800
Max memory channels		2
Compatibility
Max number of CPUs in a configuration	1
Sockets supported	FP7	FP7
Thermal Design Power (TDP)	28 Watt	35 Watt
Peripherals
PCIe configurations	Gen 4, 20 Lanes, (CPU only)
Max number of PCIe lanes		20
PCI Express revision		4.0
Graphics
Graphics max frequency		2400 MHz
Advanced Technologies
AMD SenseMI
AMD StoreMI technology
Fused Multiply-Add 3 (FMA3)
Intel® Advanced Vector Extensions (AVX)
Intel® Advanced Vector Extensions 2 (AVX2)
Intel® AES New Instructions
Virtualization
AMD Virtualization (AMD-V™)