AMD Ryzen 3 PRO 4200GE vs Intel Core i9-9900T
Comparative analysis of AMD Ryzen 3 PRO 4200GE and Intel Core i9-9900T processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Peripherals, Advanced Technologies, Virtualization, Graphics interfaces, Graphics image quality, Graphics API support, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD Ryzen 3 PRO 4200GE
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 14 nm
- Around 3% better performance in PassMark - Single thread mark: 2540 vs 2465
| Specifications (specs) | |
| Manufacturing process technology | 7 nm vs 14 nm |
| Benchmarks | |
| PassMark - Single thread mark | 2540 vs 2465 |
Reasons to consider the Intel Core i9-9900T
- 4 more cores, run more applications at once: 8 vs 4
- 8 more threads: 16 vs 8
- Around 7% higher clock speed: 4.40 GHz vs 4.1 GHz
- Around 5% higher maximum core temperature: 100°C vs 95° C
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 4x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 20% better performance in PassMark - CPU mark: 13158 vs 10930
| Specifications (specs) | |
| Number of cores | 8 vs 4 |
| Number of threads | 16 vs 8 |
| Maximum frequency | 4.40 GHz vs 4.1 GHz |
| Maximum core temperature | 100°C vs 95° C |
| L1 cache | 512 KB vs 256 KB |
| L3 cache | 16 MB vs 4 MB |
| Benchmarks | |
| PassMark - CPU mark | 13158 vs 10930 |
Compare benchmarks
CPU 1: AMD Ryzen 3 PRO 4200GE
CPU 2: Intel Core i9-9900T
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | AMD Ryzen 3 PRO 4200GE | Intel Core i9-9900T |
|---|---|---|
| PassMark - Single thread mark | 2540 | 2465 |
| PassMark - CPU mark | 10930 | 13158 |
Compare specifications (specs)
| AMD Ryzen 3 PRO 4200GE | Intel Core i9-9900T | |
|---|---|---|
Essentials |
||
| Architecture codename | Zen 2 | Coffee Lake |
| Launch date | Q3'2020 | 23 April 2019 |
| Place in performance rating | 912 | 920 |
| Vertical segment | Desktop | Desktop |
| Launch price (MSRP) | $439 | |
| Processor Number | i9-9900T | |
| Series | 9th Generation Intel Core i9 Processors | |
| Status | Launched | |
Performance |
||
| 64 bit support | ||
| Base frequency | 3.5 GHz | 2.10 GHz |
| L1 cache | 256 KB | 512 KB |
| L2 cache | 2 MB | 2 MB |
| L3 cache | 4 MB | 16 MB |
| Manufacturing process technology | 7 nm | 14 nm |
| Maximum core temperature | 95° C | 100°C |
| Maximum frequency | 4.1 GHz | 4.40 GHz |
| Number of cores | 4 | 8 |
| Number of threads | 8 | 16 |
| Transistor count | 9800 million | |
| Unlocked | ||
| Bus Speed | 8 GT/s | |
Memory |
||
| Max memory channels | 2 | 2 |
| Supported memory types | DDR4-3200 | DDR4-2666 |
| Maximum memory bandwidth | 41.6 GB/s | |
| Maximum memory size | 128 GB | |
Graphics |
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| Graphics base frequency | 1700 MHz | 350 MHz |
| Number of pipelines | 384 | |
| Processor graphics | Radeon RX Vega 6 (Ryzen 4000) | Intel UHD Graphics 630 |
| Device ID | 0x3E98 | |
| Graphics max dynamic frequency | 1.20 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Max video memory | 64 GB | |
Compatibility |
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| Sockets supported | AM4 | FCLGA1151 |
| Thermal Design Power (TDP) | 35 Watt | 35 Watt |
| Configurable TDP-down | 25 Watt | |
| Configurable TDP-down Frequency | 1.60 GHz | |
| Max number of CPUs in a configuration | 1 | |
| Package Size | 37.5mm x 37.5mm | |
| Thermal Solution | PCG 2015A (35W) | |
Peripherals |
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| Max number of PCIe lanes | 16 | 16 |
| PCI Express revision | 3.0 | 3.0 |
| PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
| Scalability | 1S Only | |
Advanced Technologies |
||
| Enhanced Virus Protection (EVP) | ||
| Fused Multiply-Add 3 (FMA3) | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® Advanced Vector Extensions 2 (AVX2) | ||
| Intel® AES New Instructions | ||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 | |
| Intel 64 | ||
| Intel® Hyper-Threading technology | ||
| Intel® Optane™ Memory Supported | ||
| Intel® Stable Image Platform Program (SIPP) | ||
| Intel® TSX-NI | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
Virtualization |
||
| AMD Virtualization (AMD-V™) | ||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
Graphics interfaces |
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| Number of displays supported | 3 | |
Graphics image quality |
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| 4K resolution support | ||
| Max resolution over DisplayPort | 4096x2304@60Hz | |
| Max resolution over eDP | 4096x2304@60Hz | |
| Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
Graphics API support |
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| DirectX | 12 | |
| OpenGL | 4.5 | |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® Memory Protection Extensions (Intel® MPX) | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Secure Boot | ||