AMD Ryzen 5 5500 vs Intel Core 2 Extreme QX9770
Comparative analysis of AMD Ryzen 5 5500 and Intel Core 2 Extreme QX9770 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the AMD Ryzen 5 5500
- CPU is newer: launch date 14 year(s) 1 month(s) later
- 2 more cores, run more applications at once: 6 vs 4
- Around 31% higher clock speed: 4.2 GHz vs 3.2 GHz
- Around 62% higher maximum core temperature: 90 °C vs 55.5°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 45 nm
- Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
- 2.1x lower typical power consumption: 65 Watt vs 136 Watt
Launch date | 4 Apr 2022 vs March 2008 |
Number of cores | 6 vs 4 |
Maximum frequency | 4.2 GHz vs 3.2 GHz |
Maximum core temperature | 90 °C vs 55.5°C |
Manufacturing process technology | 7 nm vs 45 nm |
L1 cache | 384 KB vs 256 KB |
Thermal Design Power (TDP) | 65 Watt vs 136 Watt |
Reasons to consider the Intel Core 2 Extreme QX9770
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- 4x more L2 cache, more data can be stored in the L2 cache for quick access later
Unlocked | Unlocked vs Locked |
L2 cache | 12288 KB vs 3 MB |
Compare benchmarks
CPU 1: AMD Ryzen 5 5500
CPU 2: Intel Core 2 Extreme QX9770
Name | AMD Ryzen 5 5500 | Intel Core 2 Extreme QX9770 |
---|---|---|
PassMark - Single thread mark | 3060 | |
PassMark - CPU mark | 19452 | |
3DMark Fire Strike - Physics Score | 5451 | |
Geekbench 4 - Single Core | 2338 | |
Geekbench 4 - Multi-Core | 6682 |
Compare specifications (specs)
AMD Ryzen 5 5500 | Intel Core 2 Extreme QX9770 | |
---|---|---|
Essentials |
||
Architecture codename | Zen 3 | Yorkfield |
Launch date | 4 Apr 2022 | March 2008 |
OPN Tray | 100-000000457 | |
Place in performance rating | 781 | 760 |
Vertical segment | Desktop | Desktop |
Processor Number | QX9770 | |
Series | Legacy Intel® Core™ Processors | |
Status | Discontinued | |
Performance |
||
Base frequency | 3.6 GHz | 3.20 GHz |
Die size | 180 mm² | 214 mm2 |
L1 cache | 384 KB | 256 KB |
L2 cache | 3 MB | 12288 KB |
L3 cache | 8 MB | |
Manufacturing process technology | 7 nm | 45 nm |
Maximum core temperature | 90 °C | 55.5°C |
Maximum frequency | 4.2 GHz | 3.2 GHz |
Number of cores | 6 | 4 |
Number of threads | 12 | |
Transistor count | 10700 million | 820 million |
Unlocked | ||
64 bit support | ||
Bus Speed | 1600 MHz FSB | |
Maximum case temperature (TCase) | 55 °C | |
VID voltage range | 0.8500V-1.3625V | |
Memory |
||
Max memory channels | 2 | |
Supported memory types | DDR4-3200 | DDR1, DDR2, DDR3 |
Compatibility |
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Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | AM4 | LGA775 |
Thermal Design Power (TDP) | 65 Watt | 136 Watt |
Low Halogen Options Available | ||
Package Size | 37.5mm x 37.5mm | |
Peripherals |
||
PCI Express revision | 3.0 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) |