AMD Ryzen 5 5500U vs Intel Core i3-6100
Comparative analysis of AMD Ryzen 5 5500U and Intel Core i3-6100 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Graphics image quality, Graphics API support, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the AMD Ryzen 5 5500U
- CPU is newer: launch date 5 year(s) 4 month(s) later
- 4 more cores, run more applications at once: 6 vs 2
- 8 more threads: 12 vs 4
- Around 8% higher clock speed: 4.0 GHz vs 3.7 GHz
- Around 62% higher maximum core temperature: 105 °C vs 65°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 14 nm
- 3x more L1 cache, more data can be stored in the L1 cache for quick access later
- 6x more L2 cache, more data can be stored in the L2 cache for quick access later
- 2x more L3 cache, more data can be stored in the L3 cache for quick access later
- 3.4x lower typical power consumption: 15 Watt vs 51 Watt
- Around 12% better performance in PassMark - Single thread mark: 2426 vs 2172
- 3.1x better performance in PassMark - CPU mark: 12896 vs 4126
- Around 71% better performance in 3DMark Fire Strike - Physics Score: 3761 vs 2197
Specifications (specs) | |
Launch date | 12 Jan 2021 vs September 2015 |
Number of cores | 6 vs 2 |
Number of threads | 12 vs 4 |
Maximum frequency | 4.0 GHz vs 3.7 GHz |
Maximum core temperature | 105 °C vs 65°C |
Manufacturing process technology | 7 nm vs 14 nm |
L1 cache | 384 KB vs 64 KB (per core) |
L2 cache | 3 MB vs 256 KB (per core) |
L3 cache | 8 MB vs 4096 KB (shared) |
Thermal Design Power (TDP) | 15 Watt vs 51 Watt |
Benchmarks | |
PassMark - Single thread mark | 2426 vs 2172 |
PassMark - CPU mark | 12896 vs 4126 |
3DMark Fire Strike - Physics Score | 3761 vs 2197 |
Compare benchmarks
CPU 1: AMD Ryzen 5 5500U
CPU 2: Intel Core i3-6100
PassMark - Single thread mark |
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PassMark - CPU mark |
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3DMark Fire Strike - Physics Score |
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Name | AMD Ryzen 5 5500U | Intel Core i3-6100 |
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PassMark - Single thread mark | 2426 | 2172 |
PassMark - CPU mark | 12896 | 4126 |
3DMark Fire Strike - Physics Score | 3761 | 2197 |
Geekbench 4 - Single Core | 906 | |
Geekbench 4 - Multi-Core | 1976 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 2.581 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 47.944 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.3 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 1.387 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 3.445 | |
GFXBench 4.0 - Car Chase Offscreen (Frames) | 1558 | |
GFXBench 4.0 - Manhattan (Frames) | 3264 | |
GFXBench 4.0 - T-Rex (Frames) | 5567 | |
GFXBench 4.0 - Car Chase Offscreen (Fps) | 1558 | |
GFXBench 4.0 - Manhattan (Fps) | 3264 | |
GFXBench 4.0 - T-Rex (Fps) | 5567 |
Compare specifications (specs)
AMD Ryzen 5 5500U | Intel Core i3-6100 | |
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Essentials |
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Architecture codename | Zen 2 | Skylake |
Launch date | 12 Jan 2021 | September 2015 |
OPN Tray | 100-000000375 | |
Place in performance rating | 1158 | 1460 |
Vertical segment | Laptop | Desktop |
Launch price (MSRP) | $110 | |
Price now | $147.49 | |
Processor Number | i3-6100 | |
Series | 6th Generation Intel® Core™ i3 Processors | |
Status | Launched | |
Value for money (0-100) | 10.96 | |
Performance |
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Base frequency | 2.1 GHz | 3.70 GHz |
L1 cache | 384 KB | 64 KB (per core) |
L2 cache | 3 MB | 256 KB (per core) |
L3 cache | 8 MB | 4096 KB (shared) |
Manufacturing process technology | 7 nm | 14 nm |
Maximum core temperature | 105 °C | 65°C |
Maximum frequency | 4.0 GHz | 3.7 GHz |
Number of cores | 6 | 2 |
Number of GPU cores | 6 | |
Number of threads | 12 | 4 |
64 bit support | ||
Bus Speed | 8 GT/s DMI3 | |
Die size | 150 mm | |
Maximum case temperature (TCase) | 65 °C | |
Transistor count | 1400 million | |
Memory |
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Maximum memory size | 64 GB | 64 GB |
Supported memory types | DDR4-3200, LPDDR4-4266 | DDR4-1866/2133, DDR3L-1333/1600 @ 1.35V |
ECC memory support | ||
Max memory channels | 2 | |
Maximum memory bandwidth | 34.1 GB/s | |
Graphics |
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Graphics base frequency | 1800 MHz | 350 MHz |
iGPU core count | 7 | |
Processor graphics | AMD Radeon Graphics | Intel® HD Graphics 530 |
Device ID | 0x1912 | |
Graphics max dynamic frequency | 1.05 GHz | |
Graphics max frequency | 1.05 GHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 64 GB | |
Graphics interfaces |
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DisplayPort | ||
HDMI | ||
DVI | ||
eDP | ||
Number of displays supported | 3 | |
Wireless Display (WiDi) support | ||
Compatibility |
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Configurable TDP | 10-25 Watt | |
Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | FP6 | FCLGA1151 |
Thermal Design Power (TDP) | 15 Watt | 51 Watt |
Low Halogen Options Available | ||
Package Size | 37.5mm x 37.5mm | |
Thermal Solution | PCG 2015C (65W) | |
Peripherals |
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PCI Express revision | 3.0 | 3.0 |
Max number of PCIe lanes | 16 | |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
Scalability | 1S Only | |
Graphics image quality |
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4K resolution support | ||
Max resolution over DisplayPort | 4096x2304@60Hz | |
Max resolution over eDP | 4096x2304@60Hz | |
Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
Max resolution over VGA | N / A | |
Max resolution over WiDi | 1080p | |
Graphics API support |
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DirectX | 12 | |
OpenGL | 4.5 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |