AMD Ryzen 5 8500G vs Apple A16 Bionic

Comparative analysis of AMD Ryzen 5 8500G and Apple A16 Bionic processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD Ryzen 5 8500G

Apple A16 Bionic

Differences

Reasons to consider the AMD Ryzen 5 8500G

CPU is newer: launch date 1 year(s) 4 month(s) later
6 more threads: 12 vs 6
Around 45% higher clock speed: 5 GHz vs 3.46 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 4 nm vs 5 nm
341.3x more L1 cache, more data can be stored in the L1 cache for quick access later
Around 97% better performance in PassMark - CPU mark: 21649 vs 11002

Specifications (specs)
Launch date	8 Jan 2024 vs 7 Sep 2022
Number of threads	12 vs 6
Maximum frequency	5 GHz vs 3.46 GHz
Manufacturing process technology	4 nm vs 5 nm
L1 cache	64 KB (per core) vs 192 KB instruction + 128 KB data (per core)
Benchmarks
PassMark - CPU mark	21649 vs 11002

Reasons to consider the Apple A16 Bionic

2.7x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 4% better performance in PassMark - Single thread mark: 4044 vs 3894

Specifications (specs)
L2 cache	16 MB (shared) vs 1 MB (per core)
Benchmarks
PassMark - Single thread mark	4044 vs 3894

Compare benchmarks

CPU 1: AMD Ryzen 5 8500G
CPU 2: Apple A16 Bionic

PassMark - Single thread mark

CPU 1

CPU 2

3894

4044

PassMark - CPU mark

CPU 1

CPU 2

21649

11002

Name	AMD Ryzen 5 8500G	Apple A16 Bionic
PassMark - Single thread mark	3894	4044
PassMark - CPU mark	21649	11002

Compare specifications (specs)

	AMD Ryzen 5 8500G	Apple A16 Bionic
Essentials
Launch date	8 Jan 2024	7 Sep 2022
Launch price (MSRP)	$229
Place in performance rating	225	260
Architecture codename		Everest/Sawtooth
OS Support		iOS 16.0, iOS 16.4.1, iPadOS 16.4.1
Processor Number		APL1W10
Vertical segment		Mobile
Performance
Base frequency	3.5 GHz	2.02 GHz
Die size	137 mm²
L1 cache	64 KB (per core)	192 KB instruction + 128 KB data (per core)
L2 cache	1 MB (per core)	16 MB (shared)
L3 cache	16 MB (shared)
Manufacturing process technology	4 nm	5 nm
Maximum core temperature	95°C
Maximum frequency	5 GHz	3.46 GHz
Number of cores	6	6
Number of threads	12	6
Transistor count	20,900 million	16 billion
Unlocked
Memory
ECC memory support
Supported memory types	DDR5	LPDDR5-6400
Max memory channels		1
Maximum memory bandwidth		51.2 GB/s
Maximum memory size		6 GB
Compatibility
Configurable TDP	45 Watt
Max number of CPUs in a configuration	1
Sockets supported	AM5
Thermal Design Power (TDP)	65 Watt
Peripherals
PCIe configurations	Gen 4, 14 Lanes, (CPU only)
Graphics
Execution Units		20
Graphics base frequency		1398 MHz
iGPU core count		5