AMD Ryzen 5 8640HS vs AMD Ryzen 9 7940HS

Comparative analysis of AMD Ryzen 5 8640HS and AMD Ryzen 9 7940HS processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.

 

Differences

Reasons to consider the AMD Ryzen 5 8640HS

  • CPU is newer: launch date 11 month(s) later
  • 786432x more L2 cache, more data can be stored in the L2 cache for quick access later
  • 1048576x more L3 cache, more data can be stored in the L3 cache for quick access later
  • Around 25% lower typical power consumption: 28 Watt vs 35 Watt
Launch date 6 Dec 2023 vs Jan 2023
L2 cache 1 MB (per core) vs 1MB (per core)
L3 cache 16 MB (shared) vs 16MB (shared)
Thermal Design Power (TDP) 28 Watt vs 35 Watt

Reasons to consider the AMD Ryzen 9 7940HS

  • 2 more cores, run more applications at once: 8 vs 6
  • 4 more threads: 16 vs 12
  • Around 6% higher clock speed: 5.2 GHz vs 4.9 GHz
  • Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
  • Around 6% better performance in PassMark - Single thread mark: 3901 vs 3690
  • Around 47% better performance in PassMark - CPU mark: 30351 vs 20593
Specifications (specs)
Number of cores 8 vs 6
Number of threads 16 vs 12
Maximum frequency 5.2 GHz vs 4.9 GHz
L1 cache 64K (per core) vs 64 KB (per core)
Benchmarks
PassMark - Single thread mark 3901 vs 3690
PassMark - CPU mark 30351 vs 20593

Compare benchmarks

CPU 1: AMD Ryzen 5 8640HS
CPU 2: AMD Ryzen 9 7940HS

PassMark - Single thread mark
CPU 1
CPU 2
3690
3901
PassMark - CPU mark
CPU 1
CPU 2
20593
30351
Name AMD Ryzen 5 8640HS AMD Ryzen 9 7940HS
PassMark - Single thread mark 3690 3901
PassMark - CPU mark 20593 30351
3DMark Fire Strike - Physics Score 7717

Compare specifications (specs)

AMD Ryzen 5 8640HS AMD Ryzen 9 7940HS

Essentials

Launch date 6 Dec 2023 Jan 2023
Place in performance rating 301 341

Performance

Base frequency 3.5 GHz 4 GHz
Die size 178 mm² 178 mm²
L1 cache 64 KB (per core) 64K (per core)
L2 cache 1 MB (per core) 1MB (per core)
L3 cache 16 MB (shared) 16MB (shared)
Manufacturing process technology 4 nm 4 nm
Maximum core temperature 100°C 100°C
Maximum frequency 4.9 GHz 5.2 GHz
Number of cores 6 8
Number of threads 12 16
Transistor count 25,000 million 25,000 million
Unlocked

Memory

ECC memory support
Supported memory types DDR5 DDR5-5600 MHz, Dual-channel

Compatibility

Configurable TDP 20-30 Watt 54 Watt
Max number of CPUs in a configuration 1 1
Sockets supported FP8 FP8
Thermal Design Power (TDP) 28 Watt 35 Watt

Peripherals

PCIe configurations Gen 4, 20 Lanes, (CPU only) Gen 4, 20 Lanes, (CPU only)