AMD Ryzen 5 8640U vs AMD Ryzen 9 7940HS

Comparative analysis of AMD Ryzen 5 8640U and AMD Ryzen 9 7940HS processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.

AMD Ryzen 5 8640U

AMD Ryzen 9 7940HS

Differences

Reasons to consider the AMD Ryzen 5 8640U

CPU is newer: launch date 11 month(s) later
786432x more L2 cache, more data can be stored in the L2 cache for quick access later
1048576x more L3 cache, more data can be stored in the L3 cache for quick access later
Around 25% lower typical power consumption: 28 Watt vs 35 Watt

Launch date	6 Dec 2023 vs Jan 2023
L2 cache	1 MB (per core) vs 1MB (per core)
L3 cache	16 MB (shared) vs 16MB (shared)
Thermal Design Power (TDP)	28 Watt vs 35 Watt

Reasons to consider the AMD Ryzen 9 7940HS

2 more cores, run more applications at once: 8 vs 6
4 more threads: 16 vs 12
Around 6% higher clock speed: 5.2 GHz vs 4.9 GHz
Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
Around 9% better performance in PassMark - Single thread mark: 3898 vs 3568
Around 44% better performance in PassMark - CPU mark: 30333 vs 21025

Specifications (specs)
Number of cores	8 vs 6
Number of threads	16 vs 12
Maximum frequency	5.2 GHz vs 4.9 GHz
L1 cache	64K (per core) vs 64 KB (per core)
Benchmarks
PassMark - Single thread mark	3898 vs 3568
PassMark - CPU mark	30333 vs 21025

Compare benchmarks

CPU 1: AMD Ryzen 5 8640U
CPU 2: AMD Ryzen 9 7940HS

PassMark - Single thread mark

CPU 1

CPU 2

3568

3898

PassMark - CPU mark

CPU 1

CPU 2

21025

30333

Name	AMD Ryzen 5 8640U	AMD Ryzen 9 7940HS
PassMark - Single thread mark	3568	3898
PassMark - CPU mark	21025	30333
3DMark Fire Strike - Physics Score		7717

Compare specifications (specs)

	AMD Ryzen 5 8640U	AMD Ryzen 9 7940HS
Essentials
Launch date	6 Dec 2023	Jan 2023
Place in performance rating	338	344
Performance
Base frequency	3.5 GHz	4 GHz
Die size	178 mm²	178 mm²
L1 cache	64 KB (per core)	64K (per core)
L2 cache	1 MB (per core)	1MB (per core)
L3 cache	16 MB (shared)	16MB (shared)
Manufacturing process technology	4 nm	4 nm
Maximum core temperature	100°C	100°C
Maximum frequency	4.9 GHz	5.2 GHz
Number of cores	6	8
Number of threads	12	16
Transistor count	25,000 million	25,000 million
Unlocked
Memory
ECC memory support
Supported memory types	DDR5	DDR5-5600 MHz, Dual-channel
Compatibility
Configurable TDP	15-30 Watt	54 Watt
Max number of CPUs in a configuration	1	1
Sockets supported	FP8	FP8
Thermal Design Power (TDP)	28 Watt	35 Watt
Peripherals
PCIe configurations	Gen 4, 20 Lanes, (CPU only)	Gen 4, 20 Lanes, (CPU only)