AMD Ryzen 5 8640U vs AMD Ryzen 9 PRO 6950HS

Comparative analysis of AMD Ryzen 5 8640U and AMD Ryzen 9 PRO 6950HS processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics, Graphics interfaces. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD Ryzen 5 8640U

  • CPU is newer: launch date 1 year(s) 7 month(s) later
  • Around 5% higher maximum core temperature: 100°C vs 95 °C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 4 nm vs 6 nm
  • Around 50% more L2 cache; more data can be stored in the L2 cache for quick access later
  • Around 25% lower typical power consumption: 28 Watt vs 35 Watt
  • Around 4% better performance in PassMark - Single thread mark: 3547 vs 3405
Specifications (specs)
Launch date 6 Dec 2023 vs 19 Apr 2022
Maximum core temperature 100°C vs 95 °C
Manufacturing process technology 4 nm vs 6 nm
L2 cache 1 MB (per core) vs 4 MB
Thermal Design Power (TDP) 28 Watt vs 35 Watt
Benchmarks
PassMark - Single thread mark 3547 vs 3405

Reasons to consider the AMD Ryzen 9 PRO 6950HS

  • 2 more cores, run more applications at once: 8 vs 6
  • 4 more threads: 16 vs 12
  • Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
  • Around 8% better performance in PassMark - CPU mark: 22697 vs 20971
Specifications (specs)
Number of cores 8 vs 6
Number of threads 16 vs 12
L1 cache 512 KB vs 64 KB (per core)
Benchmarks
PassMark - CPU mark 22697 vs 20971

Compare benchmarks

CPU 1: AMD Ryzen 5 8640U
CPU 2: AMD Ryzen 9 PRO 6950HS

PassMark - Single thread mark
CPU 1
CPU 2
3547
3405
PassMark - CPU mark
CPU 1
CPU 2
20971
22697
Name AMD Ryzen 5 8640U AMD Ryzen 9 PRO 6950HS
PassMark - Single thread mark 3547 3405
PassMark - CPU mark 20971 22697

Compare specifications (specs)

AMD Ryzen 5 8640U AMD Ryzen 9 PRO 6950HS

Essentials

Launch date 6 Dec 2023 19 Apr 2022
Place in performance rating 346 375
Architecture codename Zen 3+
Vertical segment Mobile

Performance

Base frequency 3.5 GHz 3.3 GHz
Die size 178 mm² 208 mm²
L1 cache 64 KB (per core) 512 KB
L2 cache 1 MB (per core) 4 MB
L3 cache 16 MB (shared) 16 MB
Manufacturing process technology 4 nm 6 nm
Maximum core temperature 100°C 95 °C
Maximum frequency 4.9 GHz 4.9 GHz
Number of cores 6 8
Number of threads 12 16
Transistor count 25,000 million
Unlocked

Memory

ECC memory support
Supported memory types DDR5 DDR5-4800
Max memory channels 2

Compatibility

Configurable TDP 15-30 Watt
Max number of CPUs in a configuration 1 1
Sockets supported FP8 FP7
Thermal Design Power (TDP) 28 Watt 35 Watt

Peripherals

PCIe configurations Gen 4, 20 Lanes, (CPU only)
Max number of PCIe lanes 20
PCI Express revision 4.0

Graphics

Graphics max dynamic frequency 2400 MHz

Graphics interfaces

DisplayPort
HDMI