AMD Ryzen 5 8640U vs AMD Ryzen 9 PRO 6950HS
Comparative analysis of AMD Ryzen 5 8640U and AMD Ryzen 9 PRO 6950HS processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics, Graphics interfaces. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD Ryzen 5 8640U
- CPU is newer: launch date 1 year(s) 7 month(s) later
- Around 5% higher maximum core temperature: 100°C vs 95 °C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 4 nm vs 6 nm
- Around 50% more L2 cache; more data can be stored in the L2 cache for quick access later
- Around 25% lower typical power consumption: 28 Watt vs 35 Watt
- Around 4% better performance in PassMark - Single thread mark: 3547 vs 3405
Specifications (specs) | |
Launch date | 6 Dec 2023 vs 19 Apr 2022 |
Maximum core temperature | 100°C vs 95 °C |
Manufacturing process technology | 4 nm vs 6 nm |
L2 cache | 1 MB (per core) vs 4 MB |
Thermal Design Power (TDP) | 28 Watt vs 35 Watt |
Benchmarks | |
PassMark - Single thread mark | 3547 vs 3405 |
Reasons to consider the AMD Ryzen 9 PRO 6950HS
- 2 more cores, run more applications at once: 8 vs 6
- 4 more threads: 16 vs 12
- Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
- Around 8% better performance in PassMark - CPU mark: 22697 vs 20971
Specifications (specs) | |
Number of cores | 8 vs 6 |
Number of threads | 16 vs 12 |
L1 cache | 512 KB vs 64 KB (per core) |
Benchmarks | |
PassMark - CPU mark | 22697 vs 20971 |
Compare benchmarks
CPU 1: AMD Ryzen 5 8640U
CPU 2: AMD Ryzen 9 PRO 6950HS
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Ryzen 5 8640U | AMD Ryzen 9 PRO 6950HS |
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PassMark - Single thread mark | 3547 | 3405 |
PassMark - CPU mark | 20971 | 22697 |
Compare specifications (specs)
AMD Ryzen 5 8640U | AMD Ryzen 9 PRO 6950HS | |
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Essentials |
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Launch date | 6 Dec 2023 | 19 Apr 2022 |
Place in performance rating | 346 | 375 |
Architecture codename | Zen 3+ | |
Vertical segment | Mobile | |
Performance |
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Base frequency | 3.5 GHz | 3.3 GHz |
Die size | 178 mm² | 208 mm² |
L1 cache | 64 KB (per core) | 512 KB |
L2 cache | 1 MB (per core) | 4 MB |
L3 cache | 16 MB (shared) | 16 MB |
Manufacturing process technology | 4 nm | 6 nm |
Maximum core temperature | 100°C | 95 °C |
Maximum frequency | 4.9 GHz | 4.9 GHz |
Number of cores | 6 | 8 |
Number of threads | 12 | 16 |
Transistor count | 25,000 million | |
Unlocked | ||
Memory |
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ECC memory support | ||
Supported memory types | DDR5 | DDR5-4800 |
Max memory channels | 2 | |
Compatibility |
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Configurable TDP | 15-30 Watt | |
Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | FP8 | FP7 |
Thermal Design Power (TDP) | 28 Watt | 35 Watt |
Peripherals |
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PCIe configurations | Gen 4, 20 Lanes, (CPU only) | |
Max number of PCIe lanes | 20 | |
PCI Express revision | 4.0 | |
Graphics |
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Graphics max dynamic frequency | 2400 MHz | |
Graphics interfaces |
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DisplayPort | ||
HDMI |