AMD Ryzen 5 PRO 8640HS vs Apple A16 Bionic

Comparative analysis of AMD Ryzen 5 PRO 8640HS and Apple A16 Bionic processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD Ryzen 5 PRO 8640HS

Apple A16 Bionic

Differences

Reasons to consider the AMD Ryzen 5 PRO 8640HS

CPU is newer: launch date 1 year(s) 7 month(s) later
6 more threads: 12 vs 6
Around 42% higher clock speed: 4.9 GHz vs 3.46 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 4 nm vs 5 nm
341.3x more L1 cache, more data can be stored in the L1 cache for quick access later
Around 97% better performance in PassMark - CPU mark: 21773 vs 11047

Specifications (specs)
Launch date	16 Apr 2024 vs 7 Sep 2022
Number of threads	12 vs 6
Maximum frequency	4.9 GHz vs 3.46 GHz
Manufacturing process technology	4 nm vs 5 nm
L1 cache	64 KB (per core) vs 192 KB instruction + 128 KB data (per core)
Benchmarks
PassMark - CPU mark	21773 vs 11047

Reasons to consider the Apple A16 Bionic

2.7x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 10% better performance in PassMark - Single thread mark: 4065 vs 3712

Specifications (specs)
L2 cache	16 MB (shared) vs 1 MB (per core)
Benchmarks
PassMark - Single thread mark	4065 vs 3712

Compare benchmarks

CPU 1: AMD Ryzen 5 PRO 8640HS
CPU 2: Apple A16 Bionic

PassMark - Single thread mark

CPU 1

CPU 2

3712

4065

PassMark - CPU mark

CPU 1

CPU 2

21773

11047

Name	AMD Ryzen 5 PRO 8640HS	Apple A16 Bionic
PassMark - Single thread mark	3712	4065
PassMark - CPU mark	21773	11047

Compare specifications (specs)

	AMD Ryzen 5 PRO 8640HS	Apple A16 Bionic
Essentials
Launch date	16 Apr 2024	7 Sep 2022
Place in performance rating	283	275
Architecture codename		Everest/Sawtooth
OS Support		iOS 16.0, iOS 16.4.1, iPadOS 16.4.1
Processor Number		APL1W10
Vertical segment		Mobile
Performance
Base frequency	3.5 GHz	2.02 GHz
Die size	178 mm²
L1 cache	64 KB (per core)	192 KB instruction + 128 KB data (per core)
L2 cache	1 MB (per core)	16 MB (shared)
L3 cache	16 MB (shared)
Manufacturing process technology	4 nm	5 nm
Maximum core temperature	100°C
Maximum frequency	4.9 GHz	3.46 GHz
Number of cores	6	6
Number of threads	12	6
Transistor count	25,000 million	16 billion
Unlocked
Memory
ECC memory support
Supported memory types	DDR5	LPDDR5-6400
Max memory channels		1
Maximum memory bandwidth		51.2 GB/s
Maximum memory size		6 GB
Compatibility
Configurable TDP	20-30 Watt
Max number of CPUs in a configuration	1
Sockets supported	FP7
Thermal Design Power (TDP)	28 Watt
Peripherals
PCIe configurations	Gen 4, 20 Lanes, (CPU only)
Graphics
Execution Units		20
Graphics base frequency		1398 MHz
iGPU core count		5