AMD Ryzen 7 5700X3D vs Intel Core i7-11700KF
Comparative analysis of AMD Ryzen 7 5700X3D and Intel Core i7-11700KF processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the AMD Ryzen 7 5700X3D
- CPU is newer: launch date 2 year(s) 9 month(s) later
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 14 nm
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- 6x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 19% lower typical power consumption: 105 Watt vs 125 Watt
- Around 10% better performance in PassMark - CPU mark: 26356 vs 23921
Specifications (specs) | |
Launch date | 8 Jan 2024 vs 16 Mar 2021 |
Manufacturing process technology | 7 nm vs 14 nm |
L2 cache | 512 KB (per core) vs 2 MB |
L3 cache | 96 MB (shared) vs 16 MB |
Thermal Design Power (TDP) | 105 Watt vs 125 Watt |
Benchmarks | |
PassMark - CPU mark | 26356 vs 23921 |
Reasons to consider the Intel Core i7-11700KF
- Around 22% higher clock speed: 5.00 GHz vs 4.1 GHz
- Around 11% higher maximum core temperature: 100°C vs 90°C
- Around 13% better performance in PassMark - Single thread mark: 3381 vs 2979
Specifications (specs) | |
Maximum frequency | 5.00 GHz vs 4.1 GHz |
Maximum core temperature | 100°C vs 90°C |
Benchmarks | |
PassMark - Single thread mark | 3381 vs 2979 |
Compare benchmarks
CPU 1: AMD Ryzen 7 5700X3D
CPU 2: Intel Core i7-11700KF
PassMark - Single thread mark |
|
|
||||
PassMark - CPU mark |
|
|
Name | AMD Ryzen 7 5700X3D | Intel Core i7-11700KF |
---|---|---|
PassMark - Single thread mark | 2979 | 3381 |
PassMark - CPU mark | 26356 | 23921 |
3DMark Fire Strike - Physics Score | 8101 |
Compare specifications (specs)
AMD Ryzen 7 5700X3D | Intel Core i7-11700KF | |
---|---|---|
Essentials |
||
Launch date | 8 Jan 2024 | 16 Mar 2021 |
Launch price (MSRP) | $249 | $374 - $384 |
Place in performance rating | 493 | 506 |
Architecture codename | Rocket Lake | |
Processor Number | i7-11700KF | |
Series | 11th Generation Intel Core i7 Processors | |
Status | Launched | |
Vertical segment | Desktop | |
Performance |
||
Base frequency | 3 GHz | 3.60 GHz |
Die size | 74 mm² | |
L1 cache | 64 KB (per core) | 512 KB |
L2 cache | 512 KB (per core) | 2 MB |
L3 cache | 96 MB (shared) | 16 MB |
Manufacturing process technology | 7 nm | 14 nm |
Maximum core temperature | 90°C | 100°C |
Maximum frequency | 4.1 GHz | 5.00 GHz |
Number of cores | 8 | 8 |
Number of threads | 16 | 16 |
Transistor count | 8,850 million | |
Unlocked | ||
64 bit support | ||
Bus Speed | 8 GT/s | |
Memory |
||
ECC memory support | ||
Supported memory types | DDR4 | DDR4-3200 |
Max memory channels | 2 | |
Maximum memory bandwidth | 50 GB/s | |
Maximum memory size | 128 GB | |
Compatibility |
||
Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | AM4 | FCLGA1200 |
Thermal Design Power (TDP) | 105 Watt | 125 Watt |
Configurable TDP-down | 95 Watt | |
Configurable TDP-down Frequency | 3.10 GHz | |
Package Size | 37.5 mm x 37.5 mm | |
Thermal Solution | PCG 2019A | |
Peripherals |
||
PCIe configurations | Gen 4, 20 Lanes, (CPU only) | Up to 1x16+1x4, 2x8+1x4, 1x8+3x4 |
Max number of PCIe lanes | 20 | |
PCI Express revision | 4.0 | |
Scalability | 1S Only | |
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
||
Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2, Intel AVX-512 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® Thermal Velocity Boost | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |