AMD Ryzen 7 7840H vs Intel Core i5-4570
Comparative analysis of AMD Ryzen 7 7840H and Intel Core i5-4570 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the AMD Ryzen 7 7840H
- CPU is newer: launch date 9 year(s) 7 month(s) later
- 4 more cores, run more applications at once: 8 vs 4
- 12 more threads: 16 vs 4
- Around 42% higher clock speed: 5.1 GHz vs 3.60 GHz
- Around 38% higher maximum core temperature: 100°C vs 72.72°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 4 nm vs 22 nm
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2.4x lower typical power consumption: 35 Watt vs 84 Watt
- Around 78% better performance in PassMark - Single thread mark: 3627 vs 2033
- 5.3x better performance in PassMark - CPU mark: 27901 vs 5238
Specifications (specs) | |
Launch date | Jan 2023 vs June 2013 |
Number of cores | 8 vs 4 |
Number of threads | 16 vs 4 |
Maximum frequency | 5.1 GHz vs 3.60 GHz |
Maximum core temperature | 100°C vs 72.72°C |
Manufacturing process technology | 4 nm vs 22 nm |
L1 cache | 64K (per core) vs 64 KB (per core) |
Thermal Design Power (TDP) | 35 Watt vs 84 Watt |
Benchmarks | |
PassMark - Single thread mark | 3627 vs 2033 |
PassMark - CPU mark | 27901 vs 5238 |
Reasons to consider the Intel Core i5-4570
- 131072x more L2 cache, more data can be stored in the L2 cache for quick access later
- 393216x more L3 cache, more data can be stored in the L3 cache for quick access later
L2 cache | 256 KB (per core) vs 1MB (per core) |
L3 cache | 6144 KB (shared) vs 16MB (shared) |
Compare benchmarks
CPU 1: AMD Ryzen 7 7840H
CPU 2: Intel Core i5-4570
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Ryzen 7 7840H | Intel Core i5-4570 |
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PassMark - Single thread mark | 3627 | 2033 |
PassMark - CPU mark | 27901 | 5238 |
Geekbench 4 - Single Core | 861 | |
Geekbench 4 - Multi-Core | 2767 | |
3DMark Fire Strike - Physics Score | 2833 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 3.626 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 74.525 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.434 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 2.048 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 5.537 | |
GFXBench 4.0 - Car Chase Offscreen (Frames) | 1143 | |
GFXBench 4.0 - Manhattan (Frames) | 2080 | |
GFXBench 4.0 - T-Rex (Frames) | 3326 | |
GFXBench 4.0 - Car Chase Offscreen (Fps) | 1143 | |
GFXBench 4.0 - Manhattan (Fps) | 2080 | |
GFXBench 4.0 - T-Rex (Fps) | 3326 |
Compare specifications (specs)
AMD Ryzen 7 7840H | Intel Core i5-4570 | |
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Essentials |
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Launch date | Jan 2023 | June 2013 |
Place in performance rating | 250 | 1797 |
Architecture codename | Haswell | |
Launch price (MSRP) | $221 | |
Price now | $174.99 | |
Processor Number | i5-4570 | |
Series | 4th Generation Intel® Core™ i5 Processors | |
Status | Discontinued | |
Value for money (0-100) | 11.99 | |
Vertical segment | Desktop | |
Performance |
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Base frequency | 3.8 GHz | 3.20 GHz |
Die size | 178 mm² | 177 mm |
L1 cache | 64K (per core) | 64 KB (per core) |
L2 cache | 1MB (per core) | 256 KB (per core) |
L3 cache | 16MB (shared) | 6144 KB (shared) |
Manufacturing process technology | 4 nm | 22 nm |
Maximum core temperature | 100°C | 72.72°C |
Maximum frequency | 5.1 GHz | 3.60 GHz |
Number of cores | 8 | 4 |
Number of threads | 16 | 4 |
Transistor count | 25,000 million | 1400 million |
Unlocked | ||
64 bit support | ||
Bus Speed | 5 GT/s DMI2 | |
Maximum case temperature (TCase) | 72 °C | |
Memory |
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ECC memory support | ||
Supported memory types | DDR5-5600 MHz, Dual-channel | DDR3-1333/1600, DDR3L-1333/1600 @ 1.5V |
Max memory channels | 2 | |
Maximum memory bandwidth | 25.6 GB/s | |
Maximum memory size | 32 GB | |
Compatibility |
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Configurable TDP | 35-54 Watt | |
Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | FP8 | FCLGA1150 |
Thermal Design Power (TDP) | 35 Watt | 84 Watt |
Low Halogen Options Available | ||
Package Size | 37.5mm x 37.5mm | |
Thermal Solution | PCG 2013D | |
Peripherals |
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PCIe configurations | Gen 4, 20 Lanes, (CPU only) | Up to 1x16, 2x8, 1x8+2x4 |
Max number of PCIe lanes | 16 | |
PCI Express revision | Up to 3.0 | |
Scalability | 1S Only | |
Graphics |
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Device ID | 0x412 | |
Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 1.15 GHz | |
Graphics max frequency | 1.15 GHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 2 GB | |
Processor graphics | Intel® HD Graphics 4600 | |
Graphics interfaces |
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DisplayPort | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | |
VGA | ||
Wireless Display (WiDi) support | ||
Graphics image quality |
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Max resolution over DisplayPort | 3840x2160@60Hz | |
Max resolution over eDP | 3840x2160@60Hz | |
Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
Max resolution over VGA | 1920x1200@60Hz | |
Graphics API support |
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DirectX | 11.2/12 | |
OpenGL | 4.3 | |
Security & Reliability |
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Anti-Theft technology | ||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® My WiFi technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |