AMD Ryzen 7 8840HS vs Apple A16 Bionic
Comparative analysis of AMD Ryzen 7 8840HS and Apple A16 Bionic processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD Ryzen 7 8840HS
- CPU is newer: launch date 1 year(s) 2 month(s) later
- 2 more cores, run more applications at once: 8 vs 6
- 10 more threads: 16 vs 6
- Around 47% higher clock speed: 5.1 GHz vs 3.46 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 4 nm vs 5 nm
- 455.1x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2.2x better performance in PassMark - CPU mark: 24445 vs 11066
Specifications (specs) | |
Launch date | 6 Dec 2023 vs 7 Sep 2022 |
Number of cores | 8 vs 6 |
Number of threads | 16 vs 6 |
Maximum frequency | 5.1 GHz vs 3.46 GHz |
Manufacturing process technology | 4 nm vs 5 nm |
L1 cache | 64 KB (per core) vs 192 KB instruction + 128 KB data (per core) |
Benchmarks | |
PassMark - CPU mark | 24445 vs 11066 |
Reasons to consider the Apple A16 Bionic
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 12% better performance in PassMark - Single thread mark: 4070 vs 3649
Specifications (specs) | |
L2 cache | 16 MB (shared) vs 1 MB (per core) |
Benchmarks | |
PassMark - Single thread mark | 4070 vs 3649 |
Compare benchmarks
CPU 1: AMD Ryzen 7 8840HS
CPU 2: Apple A16 Bionic
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Ryzen 7 8840HS | Apple A16 Bionic |
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PassMark - Single thread mark | 3649 | 4070 |
PassMark - CPU mark | 24445 | 11066 |
Compare specifications (specs)
AMD Ryzen 7 8840HS | Apple A16 Bionic | |
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Essentials |
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Launch date | 6 Dec 2023 | 7 Sep 2022 |
Place in performance rating | 276 | 277 |
Architecture codename | Everest/Sawtooth | |
OS Support | iOS 16.0, iOS 16.4.1, iPadOS 16.4.1 | |
Processor Number | APL1W10 | |
Vertical segment | Mobile | |
Performance |
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Base frequency | 3.3 GHz | 2.02 GHz |
Die size | 178 mm² | |
L1 cache | 64 KB (per core) | 192 KB instruction + 128 KB data (per core) |
L2 cache | 1 MB (per core) | 16 MB (shared) |
L3 cache | 16 MB (shared) | |
Manufacturing process technology | 4 nm | 5 nm |
Maximum core temperature | 100°C | |
Maximum frequency | 5.1 GHz | 3.46 GHz |
Number of cores | 8 | 6 |
Number of threads | 16 | 6 |
Transistor count | 25,000 million | 16 billion |
Unlocked | ||
Memory |
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ECC memory support | ||
Supported memory types | DDR5 | LPDDR5-6400 |
Max memory channels | 1 | |
Maximum memory bandwidth | 51.2 GB/s | |
Maximum memory size | 6 GB | |
Compatibility |
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Configurable TDP | 20-30 Watt | |
Max number of CPUs in a configuration | 1 | |
Sockets supported | FP8 | |
Thermal Design Power (TDP) | 28 Watt | |
Peripherals |
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PCIe configurations | Gen 4, 20 Lanes, (CPU only) | |
Graphics |
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Execution Units | 20 | |
Graphics base frequency | 1398 MHz | |
iGPU core count | 5 |