AMD Ryzen 7 8840HS vs Apple A16 Bionic

Comparative analysis of AMD Ryzen 7 8840HS and Apple A16 Bionic processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD Ryzen 7 8840HS

  • CPU is newer: launch date 1 year(s) 2 month(s) later
  • 2 more cores, run more applications at once: 8 vs 6
  • 10 more threads: 16 vs 6
  • Around 47% higher clock speed: 5.1 GHz vs 3.46 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 4 nm vs 5 nm
  • 455.1x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 2.2x better performance in PassMark - CPU mark: 24445 vs 11066
Specifications (specs)
Launch date 6 Dec 2023 vs 7 Sep 2022
Number of cores 8 vs 6
Number of threads 16 vs 6
Maximum frequency 5.1 GHz vs 3.46 GHz
Manufacturing process technology 4 nm vs 5 nm
L1 cache 64 KB (per core) vs 192 KB instruction + 128 KB data (per core)
Benchmarks
PassMark - CPU mark 24445 vs 11066

Reasons to consider the Apple A16 Bionic

  • 2x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 12% better performance in PassMark - Single thread mark: 4070 vs 3649
Specifications (specs)
L2 cache 16 MB (shared) vs 1 MB (per core)
Benchmarks
PassMark - Single thread mark 4070 vs 3649

Compare benchmarks

CPU 1: AMD Ryzen 7 8840HS
CPU 2: Apple A16 Bionic

PassMark - Single thread mark
CPU 1
CPU 2
3649
4070
PassMark - CPU mark
CPU 1
CPU 2
24445
11066
Name AMD Ryzen 7 8840HS Apple A16 Bionic
PassMark - Single thread mark 3649 4070
PassMark - CPU mark 24445 11066

Compare specifications (specs)

AMD Ryzen 7 8840HS Apple A16 Bionic

Essentials

Launch date 6 Dec 2023 7 Sep 2022
Place in performance rating 276 277
Architecture codename Everest/Sawtooth
OS Support iOS 16.0, iOS 16.4.1, iPadOS 16.4.1
Processor Number APL1W10
Vertical segment Mobile

Performance

Base frequency 3.3 GHz 2.02 GHz
Die size 178 mm²
L1 cache 64 KB (per core) 192 KB instruction + 128 KB data (per core)
L2 cache 1 MB (per core) 16 MB (shared)
L3 cache 16 MB (shared)
Manufacturing process technology 4 nm 5 nm
Maximum core temperature 100°C
Maximum frequency 5.1 GHz 3.46 GHz
Number of cores 8 6
Number of threads 16 6
Transistor count 25,000 million 16 billion
Unlocked

Memory

ECC memory support
Supported memory types DDR5 LPDDR5-6400
Max memory channels 1
Maximum memory bandwidth 51.2 GB/s
Maximum memory size 6 GB

Compatibility

Configurable TDP 20-30 Watt
Max number of CPUs in a configuration 1
Sockets supported FP8
Thermal Design Power (TDP) 28 Watt

Peripherals

PCIe configurations Gen 4, 20 Lanes, (CPU only)

Graphics

Execution Units 20
Graphics base frequency 1398 MHz
iGPU core count 5