AMD Ryzen 7 8840U vs Apple A16 Bionic

Comparative analysis of AMD Ryzen 7 8840U and Apple A16 Bionic processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD Ryzen 7 8840U

Apple A16 Bionic

Differences

Reasons to consider the AMD Ryzen 7 8840U

CPU is newer: launch date 1 year(s) 2 month(s) later
2 more cores, run more applications at once: 8 vs 6
10 more threads: 16 vs 6
Around 47% higher clock speed: 5.1 GHz vs 3.46 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 4 nm vs 5 nm
455.1x more L1 cache, more data can be stored in the L1 cache for quick access later
2.2x better performance in PassMark - CPU mark: 23875 vs 11055

Specifications (specs)
Launch date	6 Dec 2023 vs 7 Sep 2022
Number of cores	8 vs 6
Number of threads	16 vs 6
Maximum frequency	5.1 GHz vs 3.46 GHz
Manufacturing process technology	4 nm vs 5 nm
L1 cache	64 KB (per core) vs 192 KB instruction + 128 KB data (per core)
Benchmarks
PassMark - CPU mark	23875 vs 11055

Reasons to consider the Apple A16 Bionic

2x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 10% better performance in PassMark - Single thread mark: 4067 vs 3695

Specifications (specs)
L2 cache	16 MB (shared) vs 1 MB (per core)
Benchmarks
PassMark - Single thread mark	4067 vs 3695

Compare benchmarks

CPU 1: AMD Ryzen 7 8840U
CPU 2: Apple A16 Bionic

PassMark - Single thread mark

CPU 1

CPU 2

3695

4067

PassMark - CPU mark

CPU 1

CPU 2

23875

11055

Name	AMD Ryzen 7 8840U	Apple A16 Bionic
PassMark - Single thread mark	3695	4067
PassMark - CPU mark	23875	11055

Compare specifications (specs)

	AMD Ryzen 7 8840U	Apple A16 Bionic
Essentials
Launch date	6 Dec 2023	7 Sep 2022
Place in performance rating	270	277
Architecture codename		Everest/Sawtooth
OS Support		iOS 16.0, iOS 16.4.1, iPadOS 16.4.1
Processor Number		APL1W10
Vertical segment		Mobile
Performance
Base frequency	3.3 GHz	2.02 GHz
Die size	178 mm²
L1 cache	64 KB (per core)	192 KB instruction + 128 KB data (per core)
L2 cache	1 MB (per core)	16 MB (shared)
L3 cache	16 MB (shared)
Manufacturing process technology	4 nm	5 nm
Maximum core temperature	100°C
Maximum frequency	5.1 GHz	3.46 GHz
Number of cores	8	6
Number of threads	16	6
Transistor count	25,000 million	16 billion
Unlocked
Memory
ECC memory support
Supported memory types	DDR5	LPDDR5-6400
Max memory channels		1
Maximum memory bandwidth		51.2 GB/s
Maximum memory size		6 GB
Compatibility
Configurable TDP	15-30 Watt
Max number of CPUs in a configuration	1
Sockets supported	FP8
Thermal Design Power (TDP)	28 Watt
Peripherals
PCIe configurations	Gen 4, 20 Lanes, (CPU only)
Graphics
Execution Units		20
Graphics base frequency		1398 MHz
iGPU core count		5