AMD Ryzen 7 PRO 6850H vs Intel Xeon E5-2618L v3

Comparative analysis of AMD Ryzen 7 PRO 6850H and Intel Xeon E5-2618L v3 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the AMD Ryzen 7 PRO 6850H

  • Around 32% higher clock speed: 4.5 GHz vs 3.40 GHz
  • Around 9% higher maximum core temperature: 95 °C vs 87.025°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 6 nm vs 22 nm
  • Around 67% lower typical power consumption: 45 Watt vs 75 Watt
  • Around 70% better performance in PassMark - Single thread mark: 3234 vs 1905
  • 2.1x better performance in PassMark - CPU mark: 22975 vs 10881
Specifications (specs)
Maximum frequency 4.5 GHz vs 3.40 GHz
Maximum core temperature 95 °C vs 87.025°C
Manufacturing process technology 6 nm vs 22 nm
Thermal Design Power (TDP) 45 Watt vs 75 Watt
Benchmarks
PassMark - Single thread mark 3234 vs 1905
PassMark - CPU mark 22975 vs 10881

Reasons to consider the Intel Xeon E5-2618L v3

Max number of CPUs in a configuration 2 vs 1

Compare benchmarks

CPU 1: AMD Ryzen 7 PRO 6850H
CPU 2: Intel Xeon E5-2618L v3

PassMark - Single thread mark
CPU 1
CPU 2
3234
1905
PassMark - CPU mark
CPU 1
CPU 2
22975
10881
Name AMD Ryzen 7 PRO 6850H Intel Xeon E5-2618L v3
PassMark - Single thread mark 3234 1905
PassMark - CPU mark 22975 10881
Geekbench 4 - Single Core 3682
Geekbench 4 - Multi-Core 18932

Compare specifications (specs)

AMD Ryzen 7 PRO 6850H Intel Xeon E5-2618L v3

Essentials

Architecture codename Zen 3+ Haswell
Launch date 19 Apr 2022 Q3'14
Place in performance rating 361 337
Vertical segment Mobile Embedded
Processor Number E5-2618LV3
Series Intel® Xeon® Processor E5 v3 Family
Status Launched

Performance

Base frequency 3.2 GHz 2.30 GHz
Die size 208 mm²
L1 cache 512 KB
L2 cache 4 MB
L3 cache 16 MB
Manufacturing process technology 6 nm 22 nm
Maximum core temperature 95 °C 87.025°C
Maximum frequency 4.5 GHz 3.40 GHz
Number of cores 8 8
Number of threads 16 16
Unlocked
64 bit support
Bus Speed 8 GT/s QPI
Number of QPI Links 2
VID voltage range 0.65V–1.30V

Memory

ECC memory support
Max memory channels 2 4
Supported memory types DDR5-4800 DDR4 1600/1866
Maximum memory bandwidth 59 GB/s
Maximum memory size 768 GB

Graphics

Graphics max dynamic frequency 2200 MHz

Graphics interfaces

DisplayPort
HDMI

Compatibility

Max number of CPUs in a configuration 1 2
Sockets supported FP7 FCLGA2011-3
Thermal Design Power (TDP) 45 Watt 75 Watt
Low Halogen Options Available
Package Size 52.5mm x 45mm

Peripherals

Max number of PCIe lanes 20 40
PCI Express revision 4.0 3.0
PCIe configurations x4, x8, x16
Scalability 2S

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® AVX2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE) 46-bit
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)