AMD Ryzen 7 PRO 8840U vs Apple M2 (8-core GPU)

Comparative analysis of AMD Ryzen 7 PRO 8840U and Apple M2 (8-core GPU) processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD Ryzen 7 PRO 8840U

Apple M2 (8-core GPU)

Differences

Reasons to consider the AMD Ryzen 7 PRO 8840U

CPU is newer: launch date 1 year(s) 9 month(s) later
8 more threads: 16 vs 8
Around 46% higher clock speed: 5.1 GHz vs 3.504 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 4 nm vs 5 nm
341.3x more L1 cache, more data can be stored in the L1 cache for quick access later
2x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 53% better performance in PassMark - CPU mark: 23966 vs 15650

Specifications (specs)
Launch date	16 Apr 2024 vs 15 Jul 2022
Number of threads	16 vs 8
Maximum frequency	5.1 GHz vs 3.504 GHz
Manufacturing process technology	4 nm vs 5 nm
L1 cache	64 KB (per core) vs 192 KB instruction + 128 KB data (per core)
L2 cache	1 MB (per core) vs 4 MB
Benchmarks
PassMark - CPU mark	23966 vs 15650

Reasons to consider the Apple M2 (8-core GPU)

Around 6% better performance in PassMark - Single thread mark: 3903 vs 3695

Benchmarks
PassMark - Single thread mark	3903 vs 3695

Compare benchmarks

CPU 1: AMD Ryzen 7 PRO 8840U
CPU 2: Apple M2 (8-core GPU)

PassMark - Single thread mark

CPU 1

CPU 2

3695

3903

PassMark - CPU mark

CPU 1

CPU 2

23966

15650

Name	AMD Ryzen 7 PRO 8840U	Apple M2 (8-core GPU)
PassMark - Single thread mark	3695	3903
PassMark - CPU mark	23966	15650

Compare specifications (specs)

	AMD Ryzen 7 PRO 8840U	Apple M2 (8-core GPU)
Essentials
Launch date	16 Apr 2024	15 Jul 2022
Place in performance rating	264	267
Architecture codename		Avalanche/Blizzard
OS Support		macOS Monterey 12.4, macOS Ventura 13.3, iPadOS 16.1, iPadOS 16.4.1
Processor Number		APL1109
Performance
Base frequency	3.3 GHz	2.424 GHz
Die size	178 mm²
L1 cache	64 KB (per core)	192 KB instruction + 128 KB data (per core)
L2 cache	1 MB (per core)	4 MB
L3 cache	16 MB (shared)
Manufacturing process technology	4 nm	5 nm
Maximum core temperature	100°C
Maximum frequency	5.1 GHz	3.504 GHz
Number of cores	8	8
Number of threads	16	8
Transistor count	25,000 million	20 billion
Unlocked
Memory
ECC memory support
Supported memory types	DDR5	LPDDR5-6400
Max memory channels		2
Maximum memory bandwidth		102.4 GB/s
Maximum memory size		24 GB
Compatibility
Configurable TDP	15-30 Watt
Max number of CPUs in a configuration	1
Sockets supported	FP7
Thermal Design Power (TDP)	28 Watt
Peripherals
PCIe configurations	Gen 4, 20 Lanes, (CPU only)
Graphics
Execution Units		32
Graphics base frequency		1398 MHz
iGPU core count		8