AMD Ryzen 7 PRO 8845HS vs AMD EPYC 7313

Comparative analysis of AMD Ryzen 7 PRO 8845HS and AMD EPYC 7313 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD Ryzen 7 PRO 8845HS

AMD EPYC 7313

Differences

Reasons to consider the AMD Ryzen 7 PRO 8845HS

CPU is newer: launch date 3 year(s) 1 month(s) later
Around 38% higher clock speed: 5.1 GHz vs 3.7 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 4 nm vs 7 nm+
3.4x lower typical power consumption: 45 Watt vs 155 Watt
Around 46% better performance in PassMark - Single thread mark: 3835 vs 2626

Specifications (specs)
Launch date	16 Apr 2024 vs 15 Mar 2021
Maximum frequency	5.1 GHz vs 3.7 GHz
Manufacturing process technology	4 nm vs 7 nm+
Thermal Design Power (TDP)	45 Watt vs 155 Watt
Benchmarks
PassMark - Single thread mark	3835 vs 2626

Reasons to consider the AMD EPYC 7313

8 more cores, run more applications at once: 16 vs 8
16 more threads: 32 vs 16
2x more L1 cache, more data can be stored in the L1 cache for quick access later
8x more L3 cache, more data can be stored in the L3 cache for quick access later
2.3x better performance in PassMark - CPU mark: 67180 vs 29199

Specifications (specs)
Number of cores	16 vs 8
Number of threads	32 vs 16
L1 cache	1 MB vs 64 KB (per core)
L3 cache	128 MB vs 16 MB (shared)
Benchmarks
PassMark - CPU mark	67180 vs 29199

Compare benchmarks

CPU 1: AMD Ryzen 7 PRO 8845HS
CPU 2: AMD EPYC 7313

PassMark - Single thread mark

CPU 1

CPU 2

3835

2626

PassMark - CPU mark

CPU 1

CPU 2

29199

67180

Name	AMD Ryzen 7 PRO 8845HS	AMD EPYC 7313
PassMark - Single thread mark	3835	2626
PassMark - CPU mark	29199	67180

Compare specifications (specs)

	AMD Ryzen 7 PRO 8845HS	AMD EPYC 7313
Essentials
Launch date	16 Apr 2024	15 Mar 2021
Place in performance rating	202	209
Architecture codename		Zen 3
Launch price (MSRP)		$1083
OPN PIB		100-100000329WOF
OPN Tray		100-000000329
Vertical segment		Server
Performance
Base frequency	3.8 GHz	3.0 GHz
Die size	178 mm²
L1 cache	64 KB (per core)	1 MB
L2 cache	1 MB (per core)	8 MB
L3 cache	16 MB (shared)	128 MB
Manufacturing process technology	4 nm	7 nm+
Maximum core temperature	100°C
Maximum frequency	5.1 GHz	3.7 GHz
Number of cores	8	16
Number of threads	16	32
Transistor count	25,000 million
Unlocked
Memory
ECC memory support
Supported memory types	DDR5	DDR4-3200
Max memory channels		8
Maximum memory bandwidth		190.73 GB/s
Maximum memory size		4 TB
Compatibility
Configurable TDP	35-54 Watt	155-180 Watt
Max number of CPUs in a configuration	1
Sockets supported	FP7	SP3
Thermal Design Power (TDP)	45 Watt	155 Watt
Socket Count		1P/2P
Peripherals
PCIe configurations	Gen 4, 20 Lanes, (CPU only)
Max number of PCIe lanes		128
PCI Express revision		4.0
Advanced Technologies
AMD SenseMI
Fused Multiply-Add 3 (FMA3)
Intel® Advanced Vector Extensions (AVX)
Intel® Advanced Vector Extensions 2 (AVX2)
Intel® AES New Instructions
Virtualization
AMD Virtualization (AMD-V™)