AMD Ryzen 9 7900X3D vs Intel Core i7-10700

Comparative analysis of AMD Ryzen 9 7900X3D and Intel Core i7-10700 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score, GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).

AMD Ryzen 9 7900X3D

Intel Core i7-10700

Differences

Reasons to consider the AMD Ryzen 9 7900X3D

CPU is newer: launch date 2 year(s) 7 month(s) later
Processor is unlocked, an unlocked multiplier allows for easier overclocking
4 more cores, run more applications at once: 12 vs 8
8 more threads: 24 vs 16
Around 17% higher clock speed: 5.6 GHz vs 4.80 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 14 nm
Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
6x more L2 cache, more data can be stored in the L2 cache for quick access later
8x more L3 cache, more data can be stored in the L3 cache for quick access later
Around 42% better performance in PassMark - Single thread mark: 4133 vs 2902
3.1x better performance in PassMark - CPU mark: 50411 vs 16358
Around 68% better performance in 3DMark Fire Strike - Physics Score: 11579 vs 6896

Specifications (specs)
Launch date	4 Jan 2023 vs 27 May 2020
Unlocked	Unlocked vs Locked
Number of cores	12 vs 8
Number of threads	24 vs 16
Maximum frequency	5.6 GHz vs 4.80 GHz
Manufacturing process technology	5 nm vs 14 nm
L1 cache	768 KB vs 512 KB
L2 cache	12 MB vs 2 MB
L3 cache	128 MB vs 16 MB
Benchmarks
PassMark - Single thread mark	4133 vs 2902
PassMark - CPU mark	50411 vs 16358
3DMark Fire Strike - Physics Score	11579 vs 6896

Reasons to consider the Intel Core i7-10700

Around 12% higher maximum core temperature: 100°C vs 89 °C
Around 85% lower typical power consumption: 65 Watt vs 120 Watt

Maximum core temperature	100°C vs 89 °C
Thermal Design Power (TDP)	65 Watt vs 120 Watt

Compare benchmarks

CPU 1: AMD Ryzen 9 7900X3D
CPU 2: Intel Core i7-10700

PassMark - Single thread mark

CPU 1

CPU 2

4133

2902

PassMark - CPU mark

CPU 1

CPU 2

50411

16358

3DMark Fire Strike - Physics Score

CPU 1

CPU 2

11579

6896

Name	AMD Ryzen 9 7900X3D	Intel Core i7-10700
PassMark - Single thread mark	4133	2902
PassMark - CPU mark	50411	16358
3DMark Fire Strike - Physics Score	11579	6896
GFXBench 4.0 - Car Chase Offscreen (Frames)		2034
GFXBench 4.0 - Car Chase Offscreen (Fps)		2034
GFXBench 4.0 - Manhattan (Frames)		6970
GFXBench 4.0 - Manhattan (Fps)		6970
GFXBench 4.0 - T-Rex (Frames)		11748
GFXBench 4.0 - T-Rex (Fps)		11748

Compare specifications (specs)

	AMD Ryzen 9 7900X3D	Intel Core i7-10700
Essentials
Architecture codename	Zen 4	Comet Lake
Launch date	4 Jan 2023	27 May 2020
OPN Tray	100-000000909
Place in performance rating	107	79
Vertical segment	Desktop	Desktop
Launch price (MSRP)		$323
Processor Number		i7-10700
Series		10th Generation Intel Core i7 Processors
Status		Launched
Performance
Base frequency	4.4 GHz	2.90 GHz
Die size	71 mm²
L1 cache	768 KB	512 KB
L2 cache	12 MB	2 MB
L3 cache	128 MB	16 MB
Manufacturing process technology	5 nm	14 nm
Maximum case temperature (TCase)	47 °C
Maximum core temperature	89 °C	100°C
Maximum frequency	5.6 GHz	4.80 GHz
Number of cores	12	8
Number of threads	24	16
Transistor count	13140 million
Unlocked
64 bit support
Bus Speed		8 GT/s
Memory
ECC memory support
Max memory channels	2	2
Supported memory types	DDR5-5200	DDR4-2933
Maximum memory bandwidth		45.8 GB/s
Maximum memory size		128 GB
Compatibility
Max number of CPUs in a configuration	1	1
Sockets supported	AM5	LGA 1200
Thermal Design Power (TDP)	120 Watt	65 Watt
Package Size		37.5mm x 37.5mm
Thermal Solution		PCG 2015C
Peripherals
Max number of PCIe lanes	24	16
PCI Express revision	5.0	3.0
PCIe configurations		Up to 1x16, 2x8, 1x8+2x4
Scalability		1S Only
Advanced Technologies
Enhanced Virus Protection (EVP)
Fused Multiply-Add 3 (FMA3)
Intel® Advanced Vector Extensions (AVX)
Intel® Advanced Vector Extensions 2 (AVX2)
Intel® AES New Instructions
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions		Intel SSE4.1, Intel SSE4.2, Intel AVX2
Intel 64
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® Thermal Velocity Boost
Intel® Turbo Boost technology
Thermal Monitoring
Virtualization
AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
Graphics
Device ID		0x9BC5
Graphics base frequency		350 MHz
Graphics max dynamic frequency		1.20 GHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory		64 GB
Processor graphics		Intel UHD Graphics 630
Graphics interfaces
Number of displays supported		3
Graphics image quality
4K resolution support
Max resolution over DisplayPort		4096x2304@60Hz
Max resolution over eDP		4096x2304@60Hz
Max resolution over HDMI 1.4		4096x2160@30Hz
Graphics API support
DirectX		12
OpenGL		4.5
Security & Reliability
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Software Guard Extensions (Intel® SGX)
Secure Boot