AMD Ryzen 9 7940H vs AMD Ryzen 9 7845HX

Comparative analysis of AMD Ryzen 9 7940H and AMD Ryzen 9 7845HX processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.

AMD Ryzen 9 7940H

AMD Ryzen 9 7845HX

Differences

Reasons to consider the AMD Ryzen 9 7940H

A newer manufacturing process allows for a more powerful, yet cooler running processor: 4 nm vs 5 nm
Around 57% lower typical power consumption: 35 Watt vs 55 Watt

Manufacturing process technology	4 nm vs 5 nm
Thermal Design Power (TDP)	35 Watt vs 55 Watt

Reasons to consider the AMD Ryzen 9 7845HX

Processor is unlocked, an unlocked multiplier allows for easier overclocking
4 more cores, run more applications at once: 12 vs 8
8 more threads: 24 vs 16
Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
Around 50% more L2 cache; more data can be stored in the L2 cache for quick access later
4x more L3 cache, more data can be stored in the L3 cache for quick access later
Around 59% better performance in PassMark - CPU mark: 45712 vs 28660

Specifications (specs)
Unlocked	Unlocked vs Locked
Number of cores	12 vs 8
Number of threads	24 vs 16
L1 cache	64K (per core) vs 64K (per core)
L2 cache	1MB (per core) vs 1MB (per core)
L3 cache	64MB (shared) vs 16MB (shared)
Benchmarks
PassMark - Single thread mark	3965 vs 3956
PassMark - CPU mark	45712 vs 28660

Compare benchmarks

CPU 1: AMD Ryzen 9 7940H
CPU 2: AMD Ryzen 9 7845HX

PassMark - Single thread mark

CPU 1

CPU 2

3956

3965

PassMark - CPU mark

CPU 1

CPU 2

28660

45712

Name	AMD Ryzen 9 7940H	AMD Ryzen 9 7845HX
PassMark - Single thread mark	3956	3965
PassMark - CPU mark	28660	45712
3DMark Fire Strike - Physics Score		11279

Compare specifications (specs)

	AMD Ryzen 9 7940H	AMD Ryzen 9 7845HX
Essentials
Launch date	Jan 2023	4 Jan 2023
Place in performance rating	181	145
Architecture codename		Zen 4
Family		Dragon Range
Performance
Base frequency	4 GHz	3 GHz
Die size	178 mm²	2x 71 mm²
L1 cache	64K (per core)	64K (per core)
L2 cache	1MB (per core)	1MB (per core)
L3 cache	16MB (shared)	64MB (shared)
Manufacturing process technology	4 nm	5 nm
Maximum core temperature	100°C	100°C
Maximum frequency	5.2 GHz	5.2 GHz
Number of cores	8	12
Number of threads	16	24
Transistor count	25,000 million
Unlocked
Memory
ECC memory support
Supported memory types	DDR5-5600 MHz, Dual-channel	DDR5-5200 MHz, Dual-channel
Compatibility
Configurable TDP	54 Watt
Max number of CPUs in a configuration	1	1
Sockets supported	FP8	FL1
Thermal Design Power (TDP)	35 Watt	55 Watt
Peripherals
PCIe configurations	Gen 4, 20 Lanes, (CPU only)	Gen 5, 28 Lanes, (CPU only)