AMD Ryzen 9 7940HS vs AMD Ryzen 7 PRO 6850H

Comparative analysis of AMD Ryzen 9 7940HS and AMD Ryzen 7 PRO 6850H processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics, Graphics interfaces. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.

AMD Ryzen 9 7940HS

AMD Ryzen 7 PRO 6850H

Differences

Reasons to consider the AMD Ryzen 9 7940HS

CPU is newer: launch date 8 month(s) later
Around 16% higher clock speed: 5.2 GHz vs 4.5 GHz
Around 5% higher maximum core temperature: 100°C vs 95 °C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 4 nm vs 6 nm
Around 29% lower typical power consumption: 35 Watt vs 45 Watt
Around 21% better performance in PassMark - Single thread mark: 3912 vs 3234
Around 33% better performance in PassMark - CPU mark: 30510 vs 22975

Specifications (specs)
Launch date	Jan 2023 vs 19 Apr 2022
Maximum frequency	5.2 GHz vs 4.5 GHz
Maximum core temperature	100°C vs 95 °C
Manufacturing process technology	4 nm vs 6 nm
Thermal Design Power (TDP)	35 Watt vs 45 Watt
Benchmarks
PassMark - Single thread mark	3912 vs 3234
PassMark - CPU mark	30510 vs 22975

Reasons to consider the AMD Ryzen 7 PRO 6850H

524288x more L2 cache, more data can be stored in the L2 cache for quick access later
1048576x more L3 cache, more data can be stored in the L3 cache for quick access later

L2 cache	4 MB vs 1MB (per core)
L3 cache	16 MB vs 16MB (shared)

Compare benchmarks

CPU 1: AMD Ryzen 9 7940HS
CPU 2: AMD Ryzen 7 PRO 6850H

PassMark - Single thread mark

CPU 1

CPU 2

3912

3234

PassMark - CPU mark

CPU 1

CPU 2

30510

22975

Name	AMD Ryzen 9 7940HS	AMD Ryzen 7 PRO 6850H
PassMark - Single thread mark	3912	3234
PassMark - CPU mark	30510	22975
3DMark Fire Strike - Physics Score	7779

Compare specifications (specs)

	AMD Ryzen 9 7940HS	AMD Ryzen 7 PRO 6850H
Essentials
Launch date	Jan 2023	19 Apr 2022
Place in performance rating	367	362
Architecture codename		Zen 3+
Vertical segment		Mobile
Performance
Base frequency	4 GHz	3.2 GHz
Die size	178 mm²	208 mm²
L1 cache	64K (per core)	512 KB
L2 cache	1MB (per core)	4 MB
L3 cache	16MB (shared)	16 MB
Manufacturing process technology	4 nm	6 nm
Maximum core temperature	100°C	95 °C
Maximum frequency	5.2 GHz	4.5 GHz
Number of cores	8	8
Number of threads	16	16
Transistor count	25,000 million
Unlocked
Memory
ECC memory support
Supported memory types	DDR5-5600 MHz, Dual-channel	DDR5-4800
Max memory channels		2
Compatibility
Configurable TDP	54 Watt
Max number of CPUs in a configuration	1	1
Sockets supported	FP8	FP7
Thermal Design Power (TDP)	35 Watt	45 Watt
Peripherals
PCIe configurations	Gen 4, 20 Lanes, (CPU only)
Max number of PCIe lanes		20
PCI Express revision		4.0
Graphics
Graphics max dynamic frequency		2200 MHz
Graphics interfaces
DisplayPort
HDMI