AMD Ryzen 9 8945HS vs AMD Ryzen 7 7745HX

Comparative analysis of AMD Ryzen 9 8945HS and AMD Ryzen 7 7745HX processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD Ryzen 9 8945HS

AMD Ryzen 7 7745HX

Differences

Reasons to consider the AMD Ryzen 9 8945HS

CPU is newer: launch date 11 month(s) later
Around 2% higher clock speed: 5.2 GHz vs 5.1 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 4 nm vs 5 nm
1048576x more L2 cache, more data can be stored in the L2 cache for quick access later
524288x more L3 cache, more data can be stored in the L3 cache for quick access later
Around 22% lower typical power consumption: 45 Watt vs 55 Watt

Launch date	6 Dec 2023 vs 4 Jan 2023
Maximum frequency	5.2 GHz vs 5.1 GHz
Manufacturing process technology	4 nm vs 5 nm
L2 cache	1 MB (per core) vs 1MB (per core)
L3 cache	16 MB (shared) vs 32MB (shared)
Thermal Design Power (TDP)	45 Watt vs 55 Watt

Reasons to consider the AMD Ryzen 7 7745HX

Processor is unlocked, an unlocked multiplier allows for easier overclocking
Around 2% better performance in PassMark - Single thread mark: 3950 vs 3863
Around 10% better performance in PassMark - CPU mark: 32709 vs 29776

Specifications (specs)
Unlocked	Unlocked vs Locked
Benchmarks
PassMark - Single thread mark	3950 vs 3863
PassMark - CPU mark	32709 vs 29776

Compare benchmarks

CPU 1: AMD Ryzen 9 8945HS
CPU 2: AMD Ryzen 7 7745HX

PassMark - Single thread mark

CPU 1

CPU 2

3863

3950

PassMark - CPU mark

CPU 1

CPU 2

29776

32709

Name	AMD Ryzen 9 8945HS	AMD Ryzen 7 7745HX
PassMark - Single thread mark	3863	3950
PassMark - CPU mark	29776	32709

Compare specifications (specs)

	AMD Ryzen 9 8945HS	AMD Ryzen 7 7745HX
Essentials
Launch date	6 Dec 2023	4 Jan 2023
Place in performance rating	190	159
Architecture codename		Zen 4 (Dragon Range)
Performance
Base frequency	4 GHz	3.6 GHz
Die size	178 mm²	71 mm²
L1 cache	64 KB (per core)	64K (per core)
L2 cache	1 MB (per core)	1MB (per core)
L3 cache	16 MB (shared)	32MB (shared)
Manufacturing process technology	4 nm	5 nm
Maximum core temperature	100°C	100°C
Maximum frequency	5.2 GHz	5.1 GHz
Number of cores	8	8
Number of threads	16	16
Transistor count	25,000 million	6,570 million
Unlocked
Memory
ECC memory support
Supported memory types	DDR5	DDR5-5200 MHz, Dual-channel
Compatibility
Configurable TDP	35-54 Watt	45-75 Watt
Max number of CPUs in a configuration	1	1
Sockets supported	FP8	FL1
Thermal Design Power (TDP)	45 Watt	55 Watt
Peripherals
PCIe configurations	Gen 4, 20 Lanes, (CPU only)	Gen 5, 28 Lanes, (CPU only)