AMD Ryzen Embedded R1600 vs Intel Core i3-9100TE
Comparative analysis of AMD Ryzen Embedded R1600 and Intel Core i3-9100TE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD Ryzen Embedded R1600
- Around 5% higher maximum core temperature: 105 °C vs 100°C
- 2.3x lower typical power consumption: 15 Watt vs 35 Watt
- Around 2% better performance in PassMark - Single thread mark: 1724 vs 1690
| Specifications (specs) | |
| Maximum core temperature | 105 °C vs 100°C |
| Thermal Design Power (TDP) | 15 Watt vs 35 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 1724 vs 1690 |
Reasons to consider the Intel Core i3-9100TE
- 2 more cores, run more applications at once: 4 vs 2
- Around 3% higher clock speed: 3.20 GHz vs 3.1 GHz
- Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
- Around 50% more L3 cache; more data can be stored in the L3 cache for quick access later
- Around 34% better performance in PassMark - CPU mark: 4382 vs 3276
| Specifications (specs) | |
| Number of cores | 4 vs 2 |
| Maximum frequency | 3.20 GHz vs 3.1 GHz |
| L1 cache | 256 KB vs 192 KB |
| L3 cache | 6 MB vs 4 MB |
| Benchmarks | |
| PassMark - CPU mark | 4382 vs 3276 |
Compare benchmarks
CPU 1: AMD Ryzen Embedded R1600
CPU 2: Intel Core i3-9100TE
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | AMD Ryzen Embedded R1600 | Intel Core i3-9100TE |
|---|---|---|
| PassMark - Single thread mark | 1724 | 1690 |
| PassMark - CPU mark | 3276 | 4382 |
Compare specifications (specs)
| AMD Ryzen Embedded R1600 | Intel Core i3-9100TE | |
|---|---|---|
Essentials |
||
| Architecture codename | Zen | Coffee Lake |
| Launch date | 25 Feb 2020 | Q2'19 |
| Place in performance rating | 1498 | 1507 |
| Vertical segment | Mobile | Embedded |
| Launch price (MSRP) | $122 | |
| Processor Number | i3-9100TE | |
| Series | 9th Generation Intel Core i3 Processors | |
| Status | Launched | |
Performance |
||
| Base frequency | 2.6 GHz | 2.20 GHz |
| Die size | 209.8 mm² | |
| L1 cache | 192 KB | 256 KB |
| L2 cache | 1 MB | 1 MB |
| L3 cache | 4 MB | 6 MB |
| Manufacturing process technology | 14 nm | 14 nm |
| Maximum core temperature | 105 °C | 100°C |
| Maximum frequency | 3.1 GHz | 3.20 GHz |
| Number of cores | 2 | 4 |
| Number of threads | 4 | 4 |
| Transistor count | 4950 million | |
| Unlocked | ||
| 64 bit support | ||
| Bus Speed | 8 GT/s | |
Memory |
||
| ECC memory support | ||
| Max memory channels | 2 | 2 |
| Supported memory types | DDR4-2400 | DDR-2400 |
| Maximum memory bandwidth | 37.5 GB/s | |
| Maximum memory size | 64 GB | |
Compatibility |
||
| Configurable TDP-down | 12 Watt | |
| Configurable TDP-up | 25 Watt | |
| Max number of CPUs in a configuration | 1 | 1 |
| Socket Count | FP5 | |
| Thermal Design Power (TDP) | 15 Watt | 35 Watt |
| Package Size | 37.5mm x 37.5mm | |
| Sockets supported | FCLGA1151 | |
Peripherals |
||
| Max number of PCIe lanes | 8 | 16 |
| PCI Express revision | 3.0 | 3.0 |
| PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
| Scalability | 1S Only | |
Graphics |
||
| Device ID | 0x3E98 | |
| Graphics base frequency | 350 MHz | |
| Graphics max dynamic frequency | 1.05 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Max video memory | 64 GB | |
| Processor graphics | Intel UHD Graphics 630 | |
Graphics interfaces |
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| DisplayPort | ||
| DVI | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 3 | |
Graphics image quality |
||
| 4K resolution support | ||
| Max resolution over DisplayPort | 4096 x 2304@60Hz | |
| Max resolution over eDP | 4096 x 2304@60Hz | |
Graphics API support |
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| DirectX | 12 | |
| OpenGL | 4.5 | |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® Memory Protection Extensions (Intel® MPX) | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Secure Boot | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 | |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® Optane™ Memory Supported | ||
| Intel® Stable Image Platform Program (SIPP) | ||
| Intel® Turbo Boost technology | ||
| Thermal Monitoring | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||