AMD Ryzen Embedded R2514 vs AMD Ryzen 3 3100

Comparative analysis of AMD Ryzen Embedded R2514 and AMD Ryzen 3 3100 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.

AMD Ryzen Embedded R2514

AMD Ryzen 3 3100

Differences

Reasons to consider the AMD Ryzen Embedded R2514

CPU is newer: launch date 2 year(s) 4 month(s) later
Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
4.3x lower typical power consumption: 15 Watt vs 65 Watt

Launch date	30 Sep 2022 vs 7 May 2020
L1 cache	96 KB (per core) vs 256 KB
Thermal Design Power (TDP)	15 Watt vs 65 Watt

Reasons to consider the AMD Ryzen 3 3100

Processor is unlocked, an unlocked multiplier allows for easier overclocking
Around 5% higher clock speed: 3.9 GHz vs 3.7 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 12 nm
4x more L3 cache, more data can be stored in the L3 cache for quick access later
Around 22% better performance in PassMark - Single thread mark: 2419 vs 1979
Around 70% better performance in PassMark - CPU mark: 11589 vs 6821

Specifications (specs)
Unlocked	Unlocked vs Locked
Maximum frequency	3.9 GHz vs 3.7 GHz
Manufacturing process technology	7 nm vs 12 nm
L3 cache	16 MB vs 4 MB (shared)
Benchmarks
PassMark - Single thread mark	2419 vs 1979
PassMark - CPU mark	11589 vs 6821

Compare benchmarks

CPU 1: AMD Ryzen Embedded R2514
CPU 2: AMD Ryzen 3 3100

PassMark - Single thread mark

CPU 1

CPU 2

1979

2419

PassMark - CPU mark

CPU 1

CPU 2

6821

11589

Name	AMD Ryzen Embedded R2514	AMD Ryzen 3 3100
PassMark - Single thread mark	1979	2419
PassMark - CPU mark	6821	11589
3DMark Fire Strike - Physics Score		2982

Compare specifications (specs)

	AMD Ryzen Embedded R2514	AMD Ryzen 3 3100
Essentials
Launch date	30 Sep 2022	7 May 2020
Place in performance rating	1238	1211
Architecture codename		Zen 2
Launch price (MSRP)		$99
Vertical segment		Desktop
Performance
Base frequency	2.1 GHz	3.6 GHz
Die size	210 mm²
L1 cache	96 KB (per core)	256 KB
L2 cache	512 KB (per core)	2 MB
L3 cache	4 MB (shared)	16 MB
Manufacturing process technology	12 nm	7 nm
Maximum core temperature	105°C
Maximum frequency	3.7 GHz	3.9 GHz
Number of cores	4	4
Number of threads	8	8
Transistor count	4,940 million
Unlocked
Memory
ECC memory support
Supported memory types	DDR4	DDR4-3200
Compatibility
Configurable TDP	12-35 Watt
Max number of CPUs in a configuration	1
Sockets supported	FP5	AM4
Thermal Design Power (TDP)	15 Watt	65 Watt
Peripherals
PCIe configurations	Gen 3, 16 Lanes, (CPU only)
PCI Express revision		4.0