AMD Ryzen Embedded R2544 vs Intel Core i3-10105F
Comparative analysis of AMD Ryzen Embedded R2544 and Intel Core i3-10105F processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the AMD Ryzen Embedded R2544
- CPU is newer: launch date 1 year(s) 6 month(s) later
- Around 5% higher maximum core temperature: 105°C vs 100°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 12 nm vs 14 nm
- Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 44% lower typical power consumption: 45 Watt vs 65 Watt
Launch date | 30 Sep 2022 vs 16 Mar 2021 |
Maximum core temperature | 105°C vs 100°C |
Manufacturing process technology | 12 nm vs 14 nm |
L1 cache | 96 KB (per core) vs 256 KB |
L2 cache | 512 KB (per core) vs 1 MB |
Thermal Design Power (TDP) | 45 Watt vs 65 Watt |
Reasons to consider the Intel Core i3-10105F
- Around 19% higher clock speed: 4.40 GHz vs 3.7 GHz
- Around 50% more L3 cache; more data can be stored in the L3 cache for quick access later
- Around 26% better performance in PassMark - Single thread mark: 2656 vs 2102
- Around 6% better performance in PassMark - CPU mark: 8995 vs 8486
Specifications (specs) | |
Maximum frequency | 4.40 GHz vs 3.7 GHz |
L3 cache | 6 MB vs 4 MB (shared) |
Benchmarks | |
PassMark - Single thread mark | 2656 vs 2102 |
PassMark - CPU mark | 8995 vs 8486 |
Compare benchmarks
CPU 1: AMD Ryzen Embedded R2544
CPU 2: Intel Core i3-10105F
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Ryzen Embedded R2544 | Intel Core i3-10105F |
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PassMark - Single thread mark | 2102 | 2656 |
PassMark - CPU mark | 8486 | 8995 |
3DMark Fire Strike - Physics Score | 3262 |
Compare specifications (specs)
AMD Ryzen Embedded R2544 | Intel Core i3-10105F | |
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Essentials |
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Launch date | 30 Sep 2022 | 16 Mar 2021 |
Place in performance rating | 1154 | 1145 |
Architecture codename | Comet Lake | |
Launch price (MSRP) | $97 | |
Processor Number | i3-10105F | |
Series | 10th Generation Intel Core i3 Processors | |
Status | Launched | |
Vertical segment | Desktop | |
Performance |
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Base frequency | 3.35 GHz | 3.70 GHz |
Die size | 210 mm² | |
L1 cache | 96 KB (per core) | 256 KB |
L2 cache | 512 KB (per core) | 1 MB |
L3 cache | 4 MB (shared) | 6 MB |
Manufacturing process technology | 12 nm | 14 nm |
Maximum core temperature | 105°C | 100°C |
Maximum frequency | 3.7 GHz | 4.40 GHz |
Number of cores | 4 | 4 |
Number of threads | 8 | 8 |
Transistor count | 4,940 million | |
Unlocked | ||
64 bit support | ||
Bus Speed | 8 GT/s | |
Memory |
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ECC memory support | ||
Supported memory types | DDR4 | DDR4-2666 |
Max memory channels | 2 | |
Maximum memory bandwidth | 41.6 GB/s | |
Maximum memory size | 128 GB | |
Compatibility |
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Configurable TDP | 35-54 Watt | |
Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | FP5 | FCLGA1200 |
Thermal Design Power (TDP) | 45 Watt | 65 Watt |
Package Size | 37.5mm x 37.5mm | |
Thermal Solution | PCG 2015C | |
Peripherals |
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PCIe configurations | Gen 3, 16 Lanes, (CPU only) | Up to 1x16, 2x8, 1x8+2x4 |
Max number of PCIe lanes | 16 | |
PCI Express revision | 3.0 | |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® Thermal Velocity Boost | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |