AMD Ryzen Embedded V2546 vs AMD Ryzen 7 PRO 4750G

Comparative analysis of AMD Ryzen Embedded V2546 and AMD Ryzen 7 PRO 4750G processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics interfaces. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.

 

Differences

Reasons to consider the AMD Ryzen Embedded V2546

  • CPU is newer: launch date 3 month(s) later
  • Around 11% higher maximum core temperature: 105°C vs 95 °C
  • Around 86% lower typical power consumption: 35 Watt vs 65 Watt
Launch date 10 Nov 2020 vs 21 Jul 2020
Maximum core temperature 105°C vs 95 °C
Thermal Design Power (TDP) 35 Watt vs 65 Watt

Reasons to consider the AMD Ryzen 7 PRO 4750G

  • 2 more cores, run more applications at once: 8 vs 6
  • 4 more threads: 16 vs 12
  • Around 11% higher clock speed: 4.4 GHz vs 3.95 GHz
  • Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
  • Around 33% more L2 cache; more data can be stored in the L2 cache for quick access later
  • Around 8% better performance in PassMark - Single thread mark: 2714 vs 2513
  • Around 26% better performance in PassMark - CPU mark: 20470 vs 16236
Specifications (specs)
Number of cores 8 vs 6
Number of threads 16 vs 12
Maximum frequency 4.4 GHz vs 3.95 GHz
L1 cache 512 KB vs 64 KB (per core)
L2 cache 4 MB vs 512 KB (per core)
Benchmarks
PassMark - Single thread mark 2714 vs 2513
PassMark - CPU mark 20470 vs 16236

Compare benchmarks

CPU 1: AMD Ryzen Embedded V2546
CPU 2: AMD Ryzen 7 PRO 4750G

PassMark - Single thread mark
CPU 1
CPU 2
2513
2714
PassMark - CPU mark
CPU 1
CPU 2
16236
20470
Name AMD Ryzen Embedded V2546 AMD Ryzen 7 PRO 4750G
PassMark - Single thread mark 2513 2714
PassMark - CPU mark 16236 20470
3DMark Fire Strike - Physics Score 9166

Compare specifications (specs)

AMD Ryzen Embedded V2546 AMD Ryzen 7 PRO 4750G

Essentials

Launch date 10 Nov 2020 21 Jul 2020
Place in performance rating 811 800
Architecture codename Zen 2
OPN Tray 100-000000145
Vertical segment Desktop

Performance

Base frequency 3 GHz 3.6 GHz
Die size 156 mm²
L1 cache 64 KB (per core) 512 KB
L2 cache 512 KB (per core) 4 MB
L3 cache 8 MB (shared) 8 MB
Manufacturing process technology 7 nm 7 nm
Maximum core temperature 105°C 95 °C
Maximum frequency 3.95 GHz 4.4 GHz
Number of cores 6 8
Number of threads 12 16
Transistor count 9,800 million
Unlocked
Number of GPU cores 8

Memory

ECC memory support
Supported memory types DDR4 DDR4-3200
Max memory channels 2

Compatibility

Configurable TDP 54 Watt 45-65 Watt
Max number of CPUs in a configuration 1
Sockets supported FP6 AM4
Thermal Design Power (TDP) 35 Watt 65 Watt

Peripherals

PCIe configurations Gen 3, 20 Lanes, (CPU only)
PCI Express revision 3.0

Graphics interfaces

DisplayPort
HDMI