AMD Ryzen Embedded V3C18I vs AMD Ryzen 7 PRO 4700GE

Comparative analysis of AMD Ryzen Embedded V3C18I and AMD Ryzen 7 PRO 4700GE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics, Graphics interfaces. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD Ryzen Embedded V3C18I

  • CPU is newer: launch date 2 year(s) 2 month(s) later
  • Around 11% higher maximum core temperature: 105°C vs 95 °C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 6 nm vs 7 nm
  • 2x more L3 cache, more data can be stored in the L3 cache for quick access later
  • 2.3x lower typical power consumption: 15 Watt vs 35 Watt
  • Around 6% better performance in PassMark - Single thread mark: 2836 vs 2681
Specifications (specs)
Launch date 27 Sep 2022 vs 21 Jul 2020
Maximum core temperature 105°C vs 95 °C
Manufacturing process technology 6 nm vs 7 nm
L3 cache 16 MB (shared) vs 8 MB
Thermal Design Power (TDP) 15 Watt vs 35 Watt
Benchmarks
PassMark - Single thread mark 2836 vs 2681

Reasons to consider the AMD Ryzen 7 PRO 4700GE

  • Processor is unlocked, an unlocked multiplier allows for easier overclocking
  • Around 13% higher clock speed: 4.3 GHz vs 3.8 GHz
  • Around 16% better performance in PassMark - CPU mark: 19831 vs 17053
Specifications (specs)
Unlocked Unlocked vs Locked
Maximum frequency 4.3 GHz vs 3.8 GHz
Benchmarks
PassMark - CPU mark 19831 vs 17053

Compare benchmarks

CPU 1: AMD Ryzen Embedded V3C18I
CPU 2: AMD Ryzen 7 PRO 4700GE

PassMark - Single thread mark
CPU 1
CPU 2
2836
2681
PassMark - CPU mark
CPU 1
CPU 2
17053
19831
Name AMD Ryzen Embedded V3C18I AMD Ryzen 7 PRO 4700GE
PassMark - Single thread mark 2836 2681
PassMark - CPU mark 17053 19831

Compare specifications (specs)

AMD Ryzen Embedded V3C18I AMD Ryzen 7 PRO 4700GE

Essentials

Launch date 27 Sep 2022 21 Jul 2020
Place in performance rating 684 713
Architecture codename Zen 2
OPN Tray 100-000000149
Vertical segment Desktop

Performance

Base frequency 1900 MHz 3.1 GHz
L1 cache 64 KB (per core) 512 KB
L2 cache 512 KB (per core) 4 MB
L3 cache 16 MB (shared) 8 MB
Manufacturing process technology 6 nm 7 nm
Maximum core temperature 105°C 95 °C
Maximum frequency 3.8 GHz 4.3 GHz
Number of cores 8 8
Number of threads 16 16
Unlocked
Number of GPU cores 8

Memory

ECC memory support
Supported memory types DDR5 DDR4-3200
Max memory channels 2

Compatibility

Configurable TDP 10-25 Watt
Max number of CPUs in a configuration 1
Sockets supported FP7 AM4
Thermal Design Power (TDP) 15 Watt 35 Watt

Peripherals

PCIe configurations Gen 4, 20 Lanes, (CPU only)
PCI Express revision 3.0

Graphics

Graphics base frequency 2000 MHz
iGPU core count 8
Processor graphics Radeon Graphics

Graphics interfaces

DisplayPort
HDMI