AMD Ryzen Embedded V3C18I vs AMD Ryzen 7 PRO 4700GE
Comparative analysis of AMD Ryzen Embedded V3C18I and AMD Ryzen 7 PRO 4700GE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics, Graphics interfaces. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD Ryzen Embedded V3C18I
- CPU is newer: launch date 2 year(s) 2 month(s) later
- Around 11% higher maximum core temperature: 105°C vs 95 °C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 6 nm vs 7 nm
- 2x more L3 cache, more data can be stored in the L3 cache for quick access later
- 2.3x lower typical power consumption: 15 Watt vs 35 Watt
- Around 6% better performance in PassMark - Single thread mark: 2836 vs 2681
Specifications (specs) | |
Launch date | 27 Sep 2022 vs 21 Jul 2020 |
Maximum core temperature | 105°C vs 95 °C |
Manufacturing process technology | 6 nm vs 7 nm |
L3 cache | 16 MB (shared) vs 8 MB |
Thermal Design Power (TDP) | 15 Watt vs 35 Watt |
Benchmarks | |
PassMark - Single thread mark | 2836 vs 2681 |
Reasons to consider the AMD Ryzen 7 PRO 4700GE
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- Around 13% higher clock speed: 4.3 GHz vs 3.8 GHz
- Around 16% better performance in PassMark - CPU mark: 19831 vs 17053
Specifications (specs) | |
Unlocked | Unlocked vs Locked |
Maximum frequency | 4.3 GHz vs 3.8 GHz |
Benchmarks | |
PassMark - CPU mark | 19831 vs 17053 |
Compare benchmarks
CPU 1: AMD Ryzen Embedded V3C18I
CPU 2: AMD Ryzen 7 PRO 4700GE
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Ryzen Embedded V3C18I | AMD Ryzen 7 PRO 4700GE |
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PassMark - Single thread mark | 2836 | 2681 |
PassMark - CPU mark | 17053 | 19831 |
Compare specifications (specs)
AMD Ryzen Embedded V3C18I | AMD Ryzen 7 PRO 4700GE | |
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Essentials |
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Launch date | 27 Sep 2022 | 21 Jul 2020 |
Place in performance rating | 684 | 713 |
Architecture codename | Zen 2 | |
OPN Tray | 100-000000149 | |
Vertical segment | Desktop | |
Performance |
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Base frequency | 1900 MHz | 3.1 GHz |
L1 cache | 64 KB (per core) | 512 KB |
L2 cache | 512 KB (per core) | 4 MB |
L3 cache | 16 MB (shared) | 8 MB |
Manufacturing process technology | 6 nm | 7 nm |
Maximum core temperature | 105°C | 95 °C |
Maximum frequency | 3.8 GHz | 4.3 GHz |
Number of cores | 8 | 8 |
Number of threads | 16 | 16 |
Unlocked | ||
Number of GPU cores | 8 | |
Memory |
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ECC memory support | ||
Supported memory types | DDR5 | DDR4-3200 |
Max memory channels | 2 | |
Compatibility |
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Configurable TDP | 10-25 Watt | |
Max number of CPUs in a configuration | 1 | |
Sockets supported | FP7 | AM4 |
Thermal Design Power (TDP) | 15 Watt | 35 Watt |
Peripherals |
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PCIe configurations | Gen 4, 20 Lanes, (CPU only) | |
PCI Express revision | 3.0 | |
Graphics |
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Graphics base frequency | 2000 MHz | |
iGPU core count | 8 | |
Processor graphics | Radeon Graphics | |
Graphics interfaces |
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DisplayPort | ||
HDMI |