AMD Turion II M520 vs Intel Core 2 Extreme QX9775

Comparative analysis of AMD Turion II M520 and Intel Core 2 Extreme QX9775 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Advanced Technologies, Memory, Security & Reliability, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s).

AMD Turion II M520

Intel Core 2 Extreme QX9775

Differences

Reasons to consider the AMD Turion II M520

CPU is newer: launch date 1 year(s) 6 month(s) later
4.3x lower typical power consumption: 35 Watt vs 150 Watt

Launch date	10 September 2009 vs March 2008
Thermal Design Power (TDP)	35 Watt vs 150 Watt

Reasons to consider the Intel Core 2 Extreme QX9775

2 more cores, run more applications at once: 4 vs 2
Around 39% higher clock speed: 3.2 GHz vs 2.3 GHz
12x more L2 cache, more data can be stored in the L2 cache for quick access later

Number of cores	4 vs 2
Maximum frequency	3.2 GHz vs 2.3 GHz
L2 cache	12288 KB vs 1024 KB

Compare benchmarks

CPU 1: AMD Turion II M520
CPU 2: Intel Core 2 Extreme QX9775

Name	AMD Turion II M520	Intel Core 2 Extreme QX9775
PassMark - Single thread mark	925
PassMark - CPU mark	855
Geekbench 4 - Single Core	1331
Geekbench 4 - Multi-Core	2216
CompuBench 1.5 Desktop - Face Detection (mPixels/s)	1.279
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)	5.288
CompuBench 1.5 Desktop - T-Rex (Frames/s)	0.091

Compare specifications (specs)

	AMD Turion II M520	Intel Core 2 Extreme QX9775
Essentials
Architecture codename	Caspian	Yorkfield
Launch date	10 September 2009	March 2008
Place in performance rating	2661	not rated
Series	AMD Turion II	Legacy Intel® Core™ Processors
Vertical segment	Laptop	Desktop
Processor Number		QX9775
Status		Discontinued
Performance
64 bit support
Front-side bus (FSB)	3600 MHz
L1 cache	128 KB	128 KB
L2 cache	1024 KB	12288 KB
Manufacturing process technology	45 nm	45 nm
Maximum frequency	2.3 GHz	3.2 GHz
Number of cores	2	4
Number of threads	2
Base frequency		3.20 GHz
Bus Speed		1600 MHz FSB
Die size		214 mm2
Maximum case temperature (TCase)		63 °C
Maximum core temperature		63°C
Transistor count		820 million
VID voltage range		0.850V-1.3500V
Compatibility
Sockets supported	Socket S1 (s1g3) 638-pin	LGA771
Thermal Design Power (TDP)	35 Watt	150 Watt
Low Halogen Options Available
Max number of CPUs in a configuration		1
Package Size		37.5mm x 37.5mm
Advanced Technologies
PowerNow
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
Memory
Supported memory types		DDR2
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Virtualization
Intel® Virtualization Technology (VT-x)