Intel 300 vs Intel Xeon E5-2650 v4

Comparative analysis of Intel 300 and Intel Xeon E5-2650 v4 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel 300

  • Around 25% higher maximum core temperature: 100°C vs 80°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 10 nm vs 14 nm
  • 2.3x lower typical power consumption: 46 Watt vs 105 Watt
  • Around 89% better performance in PassMark - Single thread mark: 3221 vs 1707
Specifications (specs)
Maximum core temperature 100°C vs 80°C
Manufacturing process technology 10 nm vs 14 nm
Thermal Design Power (TDP) 46 Watt vs 105 Watt
Benchmarks
PassMark - Single thread mark 3221 vs 1707

Reasons to consider the Intel Xeon E5-2650 v4

  • 10 more cores, run more applications at once: 12 vs 2
  • 20 more threads: 24 vs 4
  • 3.2x better performance in PassMark - CPU mark: 22929 vs 7277
Specifications (specs)
Number of cores 12 vs 2
Number of threads 24 vs 4
Max number of CPUs in a configuration 2 vs 1
Benchmarks
PassMark - CPU mark 22929 vs 7277

Compare benchmarks

CPU 1: Intel 300
CPU 2: Intel Xeon E5-2650 v4

PassMark - Single thread mark
CPU 1
CPU 2
3221
1707
PassMark - CPU mark
CPU 1
CPU 2
7277
22929
Name Intel 300 Intel Xeon E5-2650 v4
PassMark - Single thread mark 3221 1707
PassMark - CPU mark 7277 22929
Geekbench 4 - Single Core 2672
Geekbench 4 - Multi-Core 8676

Compare specifications (specs)

Intel 300 Intel Xeon E5-2650 v4

Essentials

Launch date 8 Jan 2024 Q1'16
Launch price (MSRP) $82
Place in performance rating 639 841
Architecture codename Broadwell
Processor Number E5-2650V4
Series Intel® Xeon® Processor E5 v4 Family
Status Launched
Vertical segment Server

Performance

Base frequency 3.9 GHz 2.20 GHz
Die size 163 mm²
L1 cache 80 KB (per core)
L2 cache 1.25 MB (per core)
L3 cache 6 MB (shared)
Manufacturing process technology 10 nm 14 nm
Maximum core temperature 100°C 80°C
Number of cores 2 12
Number of threads 4 24
Unlocked
64 bit support
Bus Speed 9.6 GT/s QPI
Maximum frequency 2.90 GHz
Number of QPI Links 2
VID voltage range 0

Memory

ECC memory support
Supported memory types DDR4, DDR5 DDR4 1600/1866/2133/2400
Max memory channels 4
Maximum memory bandwidth 76.8 GB/s
Maximum memory size 1.5 TB

Compatibility

Max number of CPUs in a configuration 1 2
Sockets supported 1700 FCLGA2011-3
Thermal Design Power (TDP) 46 Watt 105 Watt
Low Halogen Options Available
Package Size 45mm x 52.5mm

Peripherals

PCIe configurations Gen 5, 16 Lanes, (CPU only) x4, x8, x16
Max number of PCIe lanes 40
PCI Express revision 3.0
Scalability 2S

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® AVX2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE) 46-bit
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)