Intel Atom 230 vs AMD Sempron 3400+
Comparative analysis of Intel Atom 230 and AMD Sempron 3400+ processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Atom 230
- CPU is newer: launch date 1 year(s) 10 month(s) later
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 90 nm
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- 15.5x lower typical power consumption: 4 Watt vs 62 Watt
| Launch date | 1 March 2008 vs May 2006 |
| Manufacturing process technology | 45 nm vs 90 nm |
| L2 cache | 512 KB vs 256 KB |
| Thermal Design Power (TDP) | 4 Watt vs 62 Watt |
Reasons to consider the AMD Sempron 3400+
- Around 13% higher clock speed: 1.8 GHz vs 1.6 GHz
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- Around 87% better performance in PassMark - Single thread mark: 346 vs 185
- Around 73% better performance in PassMark - CPU mark: 292 vs 169
| Specifications (specs) | |
| Maximum frequency | 1.8 GHz vs 1.6 GHz |
| L1 cache | 128 KB vs 64 KB (per core) |
| Benchmarks | |
| PassMark - Single thread mark | 346 vs 185 |
| PassMark - CPU mark | 292 vs 169 |
Compare benchmarks
CPU 1: Intel Atom 230
CPU 2: AMD Sempron 3400+
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Atom 230 | AMD Sempron 3400+ |
|---|---|---|
| PassMark - Single thread mark | 185 | 346 |
| PassMark - CPU mark | 169 | 292 |
| Geekbench 4 - Single Core | 436 | |
| Geekbench 4 - Multi-Core | 552 |
Compare specifications (specs)
| Intel Atom 230 | AMD Sempron 3400+ | |
|---|---|---|
Essentials |
||
| Architecture codename | Diamondville | Manila |
| Launch date | 1 March 2008 | May 2006 |
| Place in performance rating | 3231 | 3209 |
| Processor Number | 230 | |
| Series | Legacy Intel Atom® Processors | |
| Status | Discontinued | |
| Vertical segment | Desktop | Desktop |
| Launch price (MSRP) | $30 | |
| Price now | $29.91 | |
| Value for money (0-100) | 4.46 | |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.60 GHz | |
| Bus Speed | 533 MHz FSB | |
| Die size | 26 mm2 | 103 mm |
| Front-side bus (FSB) | 533 MHz | |
| L1 cache | 64 KB (per core) | 128 KB |
| L2 cache | 512 KB | 256 KB |
| Manufacturing process technology | 45 nm | 90 nm |
| Maximum core temperature | 85.2°C | |
| Maximum frequency | 1.6 GHz | 1.8 GHz |
| Number of cores | 1 | 1 |
| Number of threads | 2 | |
| Transistor count | 47 million | 81 million |
| VID voltage range | 0.9V-1.1625V | |
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 22mm x 22mm | |
| Sockets supported | PBGA437 | AM2 |
| Thermal Design Power (TDP) | 4 Watt | 62 Watt |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE2, Intel® SSE3, Intel® SSSE3 | |
| Intel 64 | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Thermal Monitoring | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||