Intel Atom 330 vs Intel Pentium D 945

Comparative analysis of Intel Atom 330 and Intel Pentium D 945 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Atom 330

Intel Pentium D 945

Differences

Reasons to consider the Intel Atom 330

CPU is newer: launch date 2 year(s) 2 month(s) later
Around 34% higher maximum core temperature: 85.2°C vs 63.4°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
4.6x more L1 cache, more data can be stored in the L1 cache for quick access later
11.9x lower typical power consumption: 8 Watt vs 95 Watt

Launch date	22 September 2008 vs July 2006
Maximum core temperature	85.2°C vs 63.4°C
Manufacturing process technology	45 nm vs 65 nm
L1 cache	64 KB (per core) vs 28 KB
Thermal Design Power (TDP)	8 Watt vs 95 Watt

Reasons to consider the Intel Pentium D 945

Around 113% higher clock speed: 3.4 GHz vs 1.6 GHz
4x more L2 cache, more data can be stored in the L2 cache for quick access later

Maximum frequency	3.4 GHz vs 1.6 GHz
L2 cache	4096 KB vs 1024 KB
Max number of CPUs in a configuration	2 vs 1

Compare benchmarks

CPU 1: Intel Atom 330
CPU 2: Intel Pentium D 945

Name	Intel Atom 330	Intel Pentium D 945
PassMark - Single thread mark	255
PassMark - CPU mark	363
Geekbench 4 - Single Core		220
Geekbench 4 - Multi-Core		389

Compare specifications (specs)

	Intel Atom 330	Intel Pentium D 945
Essentials
Architecture codename	Diamondville	Presler
Launch date	22 September 2008	July 2006
Launch price (MSRP)	$43
Place in performance rating	3180	3188
Processor Number	330	945
Series	Legacy Intel Atom® Processors	Legacy Intel® Pentium® Processor
Status	Discontinued	Discontinued
Vertical segment	Desktop	Desktop
Performance
64 bit support
Base frequency	1.60 GHz	3.40 GHz
Bus Speed	533 MHz FSB	800 MHz FSB
Die size	52 mm2	162 mm2
Front-side bus (FSB)	533 MHz
L1 cache	64 KB (per core)	28 KB
L2 cache	1024 KB	4096 KB
Manufacturing process technology	45 nm	65 nm
Maximum core temperature	85.2°C	63.4°C
Maximum frequency	1.6 GHz	3.4 GHz
Number of cores	2	2
Number of threads	4
Transistor count	94 million	376 million
VID voltage range	0.9V-1.1625V	1.200V-1.3375V
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	2
Package Size	22mm x 22mm	37.5mm x 37.5mm
Sockets supported	PBGA437	PLGA775
Thermal Design Power (TDP)	8 Watt	95 Watt
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Instruction set extensions	Intel® SSE2, Intel® SSE3, Intel® SSSE3
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
Idle States
Intel® AES New Instructions
Physical Address Extensions (PAE)		32-bit
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Memory
Supported memory types		DDR1, DDR2, DDR3