Intel Atom N2600 vs Intel Pentium M 735

Comparative analysis of Intel Atom N2600 and Intel Pentium M 735 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Atom N2600

  • CPU is newer: launch date 7 year(s) 7 month(s) later
  • 1 more cores, run more applications at once: 2 vs 1
  • 3 more threads: 4 vs 1
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 90 nm
  • 4x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 2x lower typical power consumption: 3.5 Watt vs 7.5 Watt
Launch date 28 December 2011 vs May 2004
Number of cores 2 vs 1
Number of threads 4 vs 1
Manufacturing process technology 32 nm vs 90 nm
L1 cache 64 KB (per core) vs 32 KB
Thermal Design Power (TDP) 3.5 Watt vs 7.5 Watt

Reasons to consider the Intel Pentium M 735

  • Around 6% higher clock speed: 1.7 GHz vs 1.6 GHz
  • 2x more L2 cache, more data can be stored in the L2 cache for quick access later
Maximum frequency 1.7 GHz vs 1.6 GHz
L2 cache 2048 KB vs 1024 KB

Compare benchmarks

CPU 1: Intel Atom N2600
CPU 2: Intel Pentium M 735

Name Intel Atom N2600 Intel Pentium M 735
PassMark - Single thread mark 277
PassMark - CPU mark 316
Geekbench 4 - Single Core 505
Geekbench 4 - Multi-Core 1037

Compare specifications (specs)

Intel Atom N2600 Intel Pentium M 735

Essentials

Architecture codename Cedarview Dothan
Launch date 28 December 2011 May 2004
Launch price (MSRP) $47
Place in performance rating 3098 not rated
Processor Number N2600 735
Series Intel® Atom™ Processor N Series Legacy Intel® Pentium® Processor
Status Launched Discontinued
Vertical segment Mobile Mobile

Performance

64 bit support
Base frequency 1.60 GHz 1.70 GHz
Bus Speed 2.5 GT/s DMI 400 MHz FSB
Die size 66 mm 87 mm2
L1 cache 64 KB (per core) 32 KB
L2 cache 1024 KB 2048 KB
Manufacturing process technology 32 nm 90 nm
Maximum frequency 1.6 GHz 1.7 GHz
Number of cores 2 1
Number of threads 4 1
Transistor count 176 million 144 million
Front-side bus (FSB) 400 MHz
Maximum core temperature 100°C
VID voltage range 0.988V-1.340V

Memory

Max memory channels 1
Maximum memory size 2.44 GB
Supported memory types DDR3

Graphics

Graphics base frequency 400 MHz
Processor graphics Integrated

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Sockets supported FCBGA559 PPGA478
Thermal Design Power (TDP) 3.5 Watt 7.5 Watt
Package Size 35mm x 35mm

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Instruction set extensions Intel® SSE2, Intel® SSE3, Intel® SSSE3
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
FSB parity
Idle States
Physical Address Extensions (PAE) 32-bit

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)