Intel Atom N2600 vs Intel Pentium M 735
Comparative analysis of Intel Atom N2600 and Intel Pentium M 735 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Atom N2600
- CPU is newer: launch date 7 year(s) 7 month(s) later
- 1 more cores, run more applications at once: 2 vs 1
- 3 more threads: 4 vs 1
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 90 nm
- 4x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2x lower typical power consumption: 3.5 Watt vs 7.5 Watt
Launch date | 28 December 2011 vs May 2004 |
Number of cores | 2 vs 1 |
Number of threads | 4 vs 1 |
Manufacturing process technology | 32 nm vs 90 nm |
L1 cache | 64 KB (per core) vs 32 KB |
Thermal Design Power (TDP) | 3.5 Watt vs 7.5 Watt |
Reasons to consider the Intel Pentium M 735
- Around 6% higher clock speed: 1.7 GHz vs 1.6 GHz
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
Maximum frequency | 1.7 GHz vs 1.6 GHz |
L2 cache | 2048 KB vs 1024 KB |
Compare benchmarks
CPU 1: Intel Atom N2600
CPU 2: Intel Pentium M 735
Name | Intel Atom N2600 | Intel Pentium M 735 |
---|---|---|
PassMark - Single thread mark | 277 | |
PassMark - CPU mark | 316 | |
Geekbench 4 - Single Core | 505 | |
Geekbench 4 - Multi-Core | 1037 |
Compare specifications (specs)
Intel Atom N2600 | Intel Pentium M 735 | |
---|---|---|
Essentials |
||
Architecture codename | Cedarview | Dothan |
Launch date | 28 December 2011 | May 2004 |
Launch price (MSRP) | $47 | |
Place in performance rating | 3098 | not rated |
Processor Number | N2600 | 735 |
Series | Intel® Atom™ Processor N Series | Legacy Intel® Pentium® Processor |
Status | Launched | Discontinued |
Vertical segment | Mobile | Mobile |
Performance |
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64 bit support | ||
Base frequency | 1.60 GHz | 1.70 GHz |
Bus Speed | 2.5 GT/s DMI | 400 MHz FSB |
Die size | 66 mm | 87 mm2 |
L1 cache | 64 KB (per core) | 32 KB |
L2 cache | 1024 KB | 2048 KB |
Manufacturing process technology | 32 nm | 90 nm |
Maximum frequency | 1.6 GHz | 1.7 GHz |
Number of cores | 2 | 1 |
Number of threads | 4 | 1 |
Transistor count | 176 million | 144 million |
Front-side bus (FSB) | 400 MHz | |
Maximum core temperature | 100°C | |
VID voltage range | 0.988V-1.340V | |
Memory |
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Max memory channels | 1 | |
Maximum memory size | 2.44 GB | |
Supported memory types | DDR3 | |
Graphics |
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Graphics base frequency | 400 MHz | |
Processor graphics | Integrated | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | FCBGA559 | PPGA478 |
Thermal Design Power (TDP) | 3.5 Watt | 7.5 Watt |
Package Size | 35mm x 35mm | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Instruction set extensions | Intel® SSE2, Intel® SSE3, Intel® SSSE3 | |
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
FSB parity | ||
Idle States | ||
Physical Address Extensions (PAE) | 32-bit | |
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) |