Intel Atom Z2480 vs Intel Celeron 947UE
Comparative analysis of Intel Atom Z2480 and Intel Celeron 947UE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization.
Differences
Reasons to consider the Intel Atom Z2480
- Around 43% higher clock speed: 2.00 GHz vs 1.4 GHz
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- 5.7x lower typical power consumption: 3 Watt vs 17 Watt
Maximum frequency | 2.00 GHz vs 1.4 GHz |
L2 cache | 512 KB (per core) vs 256 KB (per core) |
Thermal Design Power (TDP) | 3 Watt vs 17 Watt |
Reasons to consider the Intel Celeron 947UE
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
Manufacturing process technology | 22 nm vs 32 nm |
Compare specifications (specs)
Intel Atom Z2480 | Intel Celeron 947UE | |
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Essentials |
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Architecture codename | Penwell | Ivy Bridge |
Launch date | January 2013 | January 2013 |
Place in performance rating | not rated | not rated |
Processor Number | Z2480 | |
Series | Intel® Atom™ Processor Z Series | |
Status | Discontinued | |
Vertical segment | Mobile | Laptop |
Performance |
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Die size | 65 mm | 118 mm |
L1 cache | 64 KB (per core) | 64 KB (per core) |
L2 cache | 512 KB (per core) | 256 KB (per core) |
Manufacturing process technology | 32 nm | 22 nm |
Maximum core temperature | 90 °C | |
Maximum frequency | 2.00 GHz | 1.4 GHz |
Number of cores | 1 | 1 |
Number of threads | 2 | |
Transistor count | 140 million | 1400 million |
VID voltage range | 0.3V - 1.2V | |
64 bit support | ||
L3 cache | 1024 KB | |
Maximum case temperature (TCase) | 105 °C | |
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 6.4 GB/s | |
Maximum memory size | 2 GB | |
Supported memory types | LPDDR2 800 | DDR3 |
Graphics |
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Graphics base frequency | 400 MHz | |
Processor graphics | Integrated | |
Graphics interfaces |
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HDMI | ||
Number of displays supported | 2 | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 12mm x 12mm | |
Sockets supported | Intel BGA 617 | Intel BGA1023 |
Thermal Design Power (TDP) | 3 Watt | 17 Watt |
Peripherals |
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Number of USB ports | 1 | |
UART | ||
USB revision | 2.0 OTG | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
General-Purpose Input/Output (GPIO) | ||
Idle States | ||
Instruction set extensions | Intel® SSE, Intel® SSE2, Intel® SSE3 | |
Intel® Hyper-Threading technology | ||
Physical Address Extensions (PAE) | 32-bit | |
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) |