Intel Atom Z520 vs Intel Core 2 Extreme QX9650

Comparative analysis of Intel Atom Z520 and Intel Core 2 Extreme QX9650 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score.

Intel Atom Z520

Intel Core 2 Extreme QX9650

Differences

Reasons to consider the Intel Atom Z520

CPU is newer: launch date 5 month(s) later
Around 40% higher maximum core temperature: 90°C vs 64.5°C
65x lower typical power consumption: 2 Watt vs 130 Watt

Launch date	April 2008 vs November 2007
Maximum core temperature	90°C vs 64.5°C
Thermal Design Power (TDP)	2 Watt vs 130 Watt

Reasons to consider the Intel Core 2 Extreme QX9650

Processor is unlocked, an unlocked multiplier allows for easier overclocking
3 more cores, run more applications at once: 4 vs 1
Around 126% higher clock speed: 3 GHz vs 1.33 GHz
4x more L1 cache, more data can be stored in the L1 cache for quick access later
24x more L2 cache, more data can be stored in the L2 cache for quick access later

Unlocked	Unlocked vs Locked
Number of cores	4 vs 1
Maximum frequency	3 GHz vs 1.33 GHz
L1 cache	256 KB vs 64 KB (per core)
L2 cache	12288 KB vs 512 KB (per core)

Compare benchmarks

CPU 1: Intel Atom Z520
CPU 2: Intel Core 2 Extreme QX9650

Name	Intel Atom Z520	Intel Core 2 Extreme QX9650
PassMark - Single thread mark	151
PassMark - CPU mark	122
Geekbench 4 - Single Core		465
Geekbench 4 - Multi-Core		1463
3DMark Fire Strike - Physics Score		4864

Compare specifications (specs)

	Intel Atom Z520	Intel Core 2 Extreme QX9650
Essentials
Architecture codename	Silverthorne	Yorkfield
Launch date	April 2008	November 2007
Place in performance rating	3316	2283
Processor Number	Z520	QX9650
Series	Legacy Intel Atom® Processors	Legacy Intel® Core™ Processors
Status	Discontinued	Discontinued
Vertical segment	Mobile	Desktop
Performance
Base frequency	1.33 GHz	3.00 GHz
Bus Speed	533 MHz FSB	1333 MHz FSB
Die size	26 mm2	214 mm2
L1 cache	64 KB (per core)	256 KB
L2 cache	512 KB (per core)	12288 KB
Manufacturing process technology	45 nm	45 nm
Maximum core temperature	90°C	64.5°C
Maximum frequency	1.33 GHz	3 GHz
Number of cores	1	4
Transistor count	47 million	820 million
VID voltage range	0.75-1.1V	0.8500V-1.3625V
64 bit support
Maximum case temperature (TCase)		64 °C
Unlocked
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	13mm x 14mm	37.5mm x 37.5mm
Scenario Design Power (SDP)	0.96 W
Sockets supported	PBGA441	LGA775
Thermal Design Power (TDP)	2 Watt	130 Watt
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Instruction set extensions	Intel® SSE2, Intel® SSE3, Intel® SSSE3
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
Intel® AES New Instructions
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Memory
Supported memory types		DDR1, DDR2, DDR3