Intel Celeron 1000M vs Intel Celeron B830
Comparative analysis of Intel Celeron 1000M and Intel Celeron B830 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the Intel Celeron 1000M
- CPU is newer: launch date 4 month(s) later
- Around 5% higher maximum core temperature: 105 °C vs 100 °C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
- 2x more maximum memory size: 32 GB vs 16 GB
- Around 18% better performance in PassMark - Single thread mark: 973 vs 823
- Around 24% better performance in PassMark - CPU mark: 1069 vs 863
- Around 1% better performance in Geekbench 4 - Single Core: 325 vs 323
- Around 3% better performance in Geekbench 4 - Multi-Core: 613 vs 595
Specifications (specs) | |
Launch date | 21 January 2013 vs 2 September 2012 |
Maximum core temperature | 105 °C vs 100 °C |
Manufacturing process technology | 22 nm vs 32 nm |
Maximum memory size | 32 GB vs 16 GB |
Benchmarks | |
PassMark - Single thread mark | 973 vs 823 |
PassMark - CPU mark | 1069 vs 863 |
Geekbench 4 - Single Core | 325 vs 323 |
Geekbench 4 - Multi-Core | 613 vs 595 |
Compare benchmarks
CPU 1: Intel Celeron 1000M
CPU 2: Intel Celeron B830
PassMark - Single thread mark |
|
|
||||
PassMark - CPU mark |
|
|
||||
Geekbench 4 - Single Core |
|
|
||||
Geekbench 4 - Multi-Core |
|
|
Name | Intel Celeron 1000M | Intel Celeron B830 |
---|---|---|
PassMark - Single thread mark | 973 | 823 |
PassMark - CPU mark | 1069 | 863 |
Geekbench 4 - Single Core | 325 | 323 |
Geekbench 4 - Multi-Core | 613 | 595 |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 2.683 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 15.87 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.125 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 0.621 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 1.319 | |
GFXBench 4.0 - T-Rex (Frames) | 2055 | |
GFXBench 4.0 - T-Rex (Fps) | 2055 |
Compare specifications (specs)
Intel Celeron 1000M | Intel Celeron B830 | |
---|---|---|
Essentials |
||
Architecture codename | Ivy Bridge | Sandy Bridge |
Launch date | 21 January 2013 | 2 September 2012 |
Launch price (MSRP) | $86 | $86 |
Place in performance rating | 2829 | 2830 |
Processor Number | 1000M | B830 |
Series | Intel® Celeron® Processor 1000 Series | Legacy Intel® Celeron® Processor |
Status | Launched | Launched |
Vertical segment | Mobile | Mobile |
Performance |
||
64 bit support | ||
Base frequency | 1.80 GHz | 1.80 GHz |
Bus Speed | 5 GT/s DMI | 5 GT/s DMI |
Die size | 94 mm | 131 mm |
L1 cache | 128 KB | 64 KB (per core) |
L2 cache | 512 KB | 256 KB (per core) |
L3 cache | 2048 KB | 2048 KB |
Manufacturing process technology | 22 nm | 32 nm |
Maximum case temperature (TCase) | 105 °C | |
Maximum core temperature | 105 °C | 100 °C |
Maximum frequency | 1.8 GHz | 1.8 GHz |
Number of cores | 2 | 2 |
Number of threads | 2 | 2 |
Transistor count | 1400 million | 504 million |
Memory |
||
Max memory channels | 2 | 2 |
Maximum memory bandwidth | 25.6 GB/s | 21.3 GB/s |
Maximum memory size | 32 GB | 16 GB |
Supported memory types | DDR3/L/-RS 1333/1600 | DDR3 1066/1333 |
Graphics |
||
Graphics base frequency | 650 MHz | 650 MHz |
Graphics max dynamic frequency | 1.00 GHz | 1.05 GHz |
Graphics max frequency | 1 GHz | 1.05 GHz |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel HD Graphics | Intel HD Graphics |
Graphics interfaces |
||
CRT | ||
DisplayPort | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | 2 |
SDVO | ||
Wireless Display (WiDi) support | ||
Compatibility |
||
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mmx37.5mm (rPGA988B) | 37.5mmx37.5mm (rPGA988B) |
Sockets supported | FCPGA988 | FCPGA988 |
Thermal Design Power (TDP) | 35 Watt | 35 Watt |
Peripherals |
||
Max number of PCIe lanes | 16 | 16 |
PCI Express revision | 2.0 | 2.0 |
PCIe configurations | 1x16, 2x8, 1x8 2x4 | 1x16, 2x8, 1x8 2x4 |
Security & Reliability |
||
Anti-Theft technology | ||
Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
4G WiMAX Wireless | ||
Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | Intel® SSE4.1, Intel® SSE4.2 |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® My WiFi technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |